At electronica 2016, SWINDON Silicon Systems will show how its expertise in mixed signal ASIC/MEMS and System on Chip (SoC) technology will benefit the industry’s move towards intelligent sensing. Specialists from the SWINDON engineering team will be on hand to discuss how their custom-designed SoCs can transform raw data into valuable information.
Where sensors were once simple analogue components with basic output, the best contemporary solutions feature mixed signal ASICs with front end signal processing, calibration for varying environmental conditions and robust bidirectional communication interfaces that embody intelligence in the sensor head itself. The knock on effect is intelligent industrial automation systems that are simpler to configure and maintain.
Visitors to booth 158 in hall A5 will be able to discuss their specific development projects and requirements and discover how SWINDON have become market leaders in intelligent sensing through world class System on Chip (SoC) and System in Package (SiP) solutions.