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ADL debuts the future of embedded solution technology

3rd March 2017
Enaie Azambuja
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ADL Embedded Solutions will be showcasing brand new projects and prototypes of the next generation of embedded solutions at this year’s Embedded World. The first prototype of ADL Embedded Solution’s ADLVIS-1700 CoaXPress/Cameralink Vision system will be debuted at Embedded World. The ADLVIS-1700 is the smallest CoaXPress system in the industry (HWD = 5” x 7” x 7.6”). The CoaXPress board inside the vision box is the first of its kind at the small PCIe/104 form factor.

With 1200 MB per second camera transfer speed in a small form factor vision system, the ADLVIS-1700 helps address the need for high-performance image capture and storage in a variety of industries such as 3D machine vision, hyperspectral and multi-spectral imaging, traffic engineering, unmanned drone vision payload computing, and more.

So far this speed and resolution has only been available on desktop PCs and larger devices. ADL has also included four removable SATA drives to accommodate the storage needs of this new technology as well as a single cable to provide power while sending data up to 300 feet.

Embedded World will also showcase the successor to ADL’s popular ADLMES8200 rugged chassis, the ADLMES9200. The ADLMES9200 is now IP67-rated with lower weight, lower cost and more reliable EMC-compliant gasket interfaces for robust military and rugged industrial applications.

The IP67 allows the rugged device to not only survive water jets, but actually be underwater up to three feet for 30 minutes at a time. The lower weight will decrease fuel and battery costs while for mobile or unmanned applications such as drones, this means the drone or unmanned vehicle can stay operational for longer periods of time.

Designed to survive MIL-STD 810 rugged environments the ADLMES9200 has military and defense applications but ADL also forsees industrial applications in oil and gas, mining, construction, and transportation.

For an early look at Skylake, ADL’s new QM87HD Intel Core 6th Generation, stop by ADL’s booth at Embedded World to see an engineering sample. With hardware level TPM 2.0 encryption technology, the Skylake will combine security with powerful virtualisation capabilities.

To see what’s new in embedded technology, visit ADL Embedded Solutions booth (#1-554, Hall 1) at the Embedded World Exposition & Conference in Nuremberg, Germany on March 14 - 16, 2017.

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