Events News

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Europe’s 1st MCU Car Rally to be launched at embedded World 2014

At embedded World 2014, on stand 350 in Hall 1, Renesas will launch Europe’s first MCU Car Rally competition for students.
18th February 2014

ERNI expands COM portfolio at embedded world 2014

ERNI expands COM portfolio at embedded world 2014
At embedded world 2014, February 25-27 in Nuremberg, Germany, ERNI Electronics will present their expanded COM portfolio from Hall 4, Booth 348. The current models in the WHITEspeed COM family are complemented with new variants for higher performance and also for highly cost-sensitive applications.
18th February 2014

APEC to feature intelligent digital power technical sessions

At this year's APEC, scheduled in Fort Worth, Texas, Powervation will discuss its Intelligent Digital Power solutions for a number of applications. These applications include cloud/datacenter server infrastructure, high performance computing, power modules, and communications infrastructure.
17th February 2014


A software development approach based on embedded platforms

A software development approach based on embedded platforms
Embedded software innovations continue to expand fast, creating new markets and revenues opportunities. The growing software complexity drives investments in improving development processes for faster time-to-market and higher quality targets. Responding to these needs, MicroEJ, designed by IS2T, offers a step forward with more flexible and efficient software development processes.
17th February 2014

Microsemi to exhibit at embedded world 2014

At embedded world 2014, February 25-27, in Nuremberg, Germany, Microsemi will be exhibiting from Hall 1 Booth 121. Company representatives will be on hand to address how Microsemi’s innovative products balance processing horsepower and connectivity of embedded systems with high-performance, low power, reliability and security.
14th February 2014

Lattice explore USB 3.0, HMI and MIPI at embedded world 2014

At the Embedded World Exhibition and Conference taking place February 25-27 2014 in Nuremberg, Germany, Lattice Semiconductor will be demonstrating USB 3.0 and HMI solutions. Additionally, the company will present two papers addressing how embedded designers can use low-power, low-cost FPGAs to help implement Mobile Industry Processor Interface (MIPI) interfaces.
14th February 2014

PCIM Europe 2014 conference program revealed

PCIM Europe 2014 feature a diverse conference program: from a total of 269 abstracts, the conference directors have put together a comprehensive program covering the latest technological trends in power electronics components and systems.
12th February 2014

Apacer actively expands market presence in embedded applications

Embedded World will be held from February 25th to 27th  in Exhibition Center Nuremberg, Germany. As one of the world’s Top 10 PC SSD manufacturers with a strong foothold in industrial and embedded storage field, Apacer takes the initiative to expand overseas markets and focus on this exhibition as its most important global marketing strategy of the year. It will display six innovative SSD series in Embedded World with “Life and Endurance”, “Highest speed”, “Protection”, “Data Integrity”, “Smaller, Thinner & Lighter” and “CoreSecurity”. The new offerings are expected to create product competitiveness with differentiated advantages and make themselves the prime choices among storage devices for embedded systems. 
12th February 2014

Belden to Show Broad Range of Broadcast Solutions at BVE

Belden Inc will highlight its most comprehensive range ever of Broadcast solutions at BVE, which is to be held at Excel, London, UK from 25 to 27 February 2014.
11th February 2014

Arrow Electronics showcases embedded processing and wireless technology at Embedded World 2014

Arrow Electronics showcases embedded processing and wireless technology at Embedded World 2014
Located in Hall 4, Booth 4-560, M2M Area, the theme of Arrow Electronics’ presence at Embedded World 2014, 25-27 February, in Nuremberg will be ‘Intelligent Systems’. The company is exhibiting in the show’s M2M (machine-to-machine) section and will be focussing on two main areas: embedded processing and wireless technology.
11th February 2014


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