3D AOI & SPI systems on display at SMT Hybrid Packaging 2015
At SMT Hybrid Packaging 2015, scheduled to take place from 5th to 7th May in Nuremberg, Germany, CyberOptics will exhibit its latest lineup of 3D SPI and AOI systems in hall 7, booth 221.
The SQ3000 3D AOI system maximises ROI and line utilisation with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, enabling fast 3D inspection. The integrated MRS technology combined with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.
The SE600 3D SPI system delivers ‘true’ volume measurement and outstanding usability. Designed with a dual illumination sensor, the system offers the high repeatability and reproducibility, even on the smallest paste deposits. The award-winning SPIv5 series software provides full touch screen capability and enhanced user experience for easy inspection.
The CX150i system provides simple, fast and reliable automated conformal coating inspection using a brand-new UV strobed inspection module. Designed with an 80MP sensor, the system offers white light illumination for component presence/absence inspection and UV illumination for conformal coating inspection. Powered by Autonomous Image Interpretation (AI2) technology, the CX150i enables faster, simpler and smarter programming.
All CyberOptics’ AOI systems are powered by AI2, giving users the power to inspect ‘ANYTHING’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. This reduces false calls, escapes and tuning.
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