Nexcom Introduces Fanless Embedded System for Factory Automation

The system features a low power ETX module design and is configured with Intel’s 852GM + ICH4 chipset with either on-board Intel Celeron M 600 MHz with 512 KB L2 cache or on-board Intel Celeron M 1 GHz with 512 KB L2 cache.

The 3200 fanless system supports SO-DIMM 400 FSB memory up to 1 GB, and the Intel® 82562ET 10/100 Ethernet controller provides sufficient network traffic for data exchange. The specially designed I/O supports four serial ports for legacy device connection that includes two RS422/RS485 interfaces with Automatic Flow Control, ±15 KV ESD protected and Isolation (Optical Isolation, Max 2000 VDC) through a 10-pin screw terminal connector. Furthermore, an optional NVRAM socket is reserved for memory backup SRAM, which offers optional dedicated plug-in NVRAM memory. With the 3200 series, users have the option to add a 2nd tier expansion kit on top of the original unit, which is available upon ODM request. The utilization of the additional space on top of the original unit means the user could configure a slim-type of CD-ROM, PC/104 or PC/104-plus modules that offer customer-defined I/Os. The 3200 with Intel® based platform offers outstanding value for money and supreme performance.