Embedded system board accelerates development of AI

18th March 2019
Posted By : Lanna Cooper
Embedded system board accelerates development of AI

 

Aldec has launched the TySOM-3A-ZU19EG, to assist in the development of AI, Deep-learning Neural Network (DNN) and other applications dependent on complex algorithm acceleration in firmware.

This addition to Aldec’s family of embedded development kits showcased at embedded world in February 2019, it also features a Xilinx Zynq UltraScale+ ZU19EG FFVB1517 MPSoC, which has more than one million logic cells, and a quad-core ARM Cortex-A53 platform running at up to 1.5GHz.

The kit provides 64-bit processor scalability while combining real time control with soft and hard engines for SoC prototyping solution, IP verification, graphics, video, packet processing and early software development.

“This latest addition to the Aldec TySOM range is our most powerful yet,” commented Zibi Zalewski, General Manager of Aldec’s Hardware Division, “and while it is suitable for the development of some of today’s most complex applications, such as AI and DNN, it is an extremely scalable solution, so remains a cost effective proposition for small to mid-size SoC FPGA and ASIC prototyping. Few if any other platforms represent a similarly sound and long term investment.”

The TySOM-3A-ZU19EG is designed to provide flexibility when selecting peripherals, because of leveraging all the features of the Zynq UltraScale+.

The kit contains 8GB DDR4 SODIMM Memory for the Programmable Logic (PL) and 8GB DDR4 SODIMM Memory for the Processing System (PS). It also includes 2GB NAND memory, supports Micro-SD card storage, SATA storage and features a 512MB QSPI Flash Memory.

Communication/networking is enabled by 2x Gigabit Ethernet, WiFi & Bluetooth, CAN, 4× USB 3.0, USB to UART Bridge, USB 2.0 OTG, JTAG USB, Pmod, QSFP+ and PCIe x1 GEN3/4 connectors.

Multimedia interfaces are provided using DisplayPort, HDMI IN/OUT. To expand the peripherals, 2× FMC HPC VITA 57.1-2010 compliant connectors are provided on the board; thus, additional devices can be connected as FMC Daughter Cards (available from Aldec plus other vendors).


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)
PCIM 2019
7th May 2019
Germany Nürnberg Messe
Electronics & Applications 2019
14th May 2019
Netherlands Jaarbeurs Utrecht Hall 7 Jaarbeursplein
Agile for Automotive 2019
15th May 2019
United States of America Detroit, MI