Design

Displaying 21 - 30 of 5772

Lower power computing with Arm

Lower power computing with Arm
The modules featuring NXP i.MX 8 multi-core 32- and 64-bit ARM processors, which congatec offers in the SMARC 2.0 and Qseven standards, are robust and some are designed for the extended temperature range from -40°C to +85°C. They are predestined for a wide range of applications and even allow full solar operation with an energy consumption of less than 3-5W during normal operation. Here congatec discusses the potential industrial applications.
4th November 2019

Comprehensive protection and automation for cloud workloads

Comprehensive protection and automation for cloud workloads
Druva has announced powerful new capabilities providing industry-leading coverage for cloud workloads, strategic integrations and automated functionality, to accelerate any enterprises’ journey to the cloud. The updates include support for Slack and Microsoft Teams, new advanced backup, recovery and global policy capabilities for AWS workloads, as well as integrations with ServiceNow, Splunk and Okta. 
4th November 2019

Making the right choice: Wireless tech for the IoT

Making the right choice: Wireless tech for the IoT
Wireless connectivity is a critical part of IoT end-node design. Important and popular connectivity options for the IoT include Bluetooth Low Energy (BLE), Bluetooth mesh, Zigbee, Thread, Z-Wave, WiFi and a wide range of proprietary protocols in the sub-GHz band. Anders Pettersson, Director of Field Marketing, Silicon Labs explains.
4th November 2019


Small and light video server with AI for rugged applications

Small and light video server with AI for rugged applications
General Micro Systems (GMS), the rugged C4ISR mobile systems and servers company, has announced a small, light and SWaP-C-optimised workstation, display and general-purpose graphics processing unit (GPGPU) artificial intelligence (AI) algorithm and video processor.
4th November 2019

The design priorities shaping thermal management in 2019

The design priorities shaping thermal management in 2019
Over the next five years a flurry of new innovations and technology trends are coming into the mainstream with major implications for the world of electronics engineering. From Artificial Intelligence (AI) to edge computing, 5G to the Internet of Things (IoT), new technologies are redefining the ways that we live, work and communicate. Tom Gregory, Product Manager, Future Facilities explains.
4th November 2019

Half-duplex evaluation module supports fast development

Half-duplex evaluation module supports fast development
The RS-485 half-duplex evaluation module (EVM) helps designers evaluate device performance, supporting fast development and analysis of data-transmission systems using any of the SN65HVD1x, SN65HVD2x, SN65HVD7x, SN65HVD8x and SN65HVD96 half-duplex transceivers.
1st November 2019

Advanced real-time adaptive robotic motion control toolkit

Advanced real-time adaptive robotic motion control toolkit
Energid has released version 5.5 of the Actin software development kit (SDK), an even more powerful and easier-to-use version of the industry’s only real-time adaptive robotic motion control and path planning toolkit. Actin version 5.5 adds Actin Viewer enhancements, Motion Script updates and G-code support, making it even easier for robotic systems developers to focus on the robot’s tasks rather than joint movement and paths.
29th October 2019

Deserialiser converts FPD-Link III streams into interface

Deserialiser converts FPD-Link III streams into interface
The DS90UB948-Q1 from Texas Instruments is a FPD-Link III deserialiser which, in conjunction with the DS90UB949A/949/947-Q1 serialisers, converts 1-lane or 2-lane FPD-Link III streams into a FPD-Link (OpenLDI) interface. The Deserialiser is capable of operating over cost-effective 50-Ω single-ended coaxial or 100-Ω differential shielded twisted-pair (STP) cables. 
28th October 2019

VIP for NVMe 1.4 eases path to SoC verification

What is said to be the industry’s first Verification IP (VIP) in support of the new NVM Express 1.4 (NVMe) protocol has been released by Cadence Design Systems. The Cadence VIP for NVMe 1.4 enables designers to quickly and thoroughly verify their storage, data centre and high-performance computing (HPC) system-on-chip (SoC) designs with less effort and a greater assurance that the SoC will meet the protocol standards.
25th October 2019

External load diagnostics circuit to detect electrical faults

External load diagnostics circuit to detect electrical faults
Embedded electronics are becoming ever more present in automotive applications, particularly as a means of limiting risk to drivers. With this increasing dependence on electronic systems comes an increasing need to monitor the functioning of these systems in order to detect potentially critical errors.
25th October 2019


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SPS IPC Drives 2019
26th November 2019
Germany Nuremberg Messe
Vietnam International Defense & Security Exhibition 2020
4th March 2020
Vietnam National Convention Center, Hanoi