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Winbond Electronics Corporation

Winbond Electronics Corporation Articles

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Artificial Intelligence
29th September 2023
Winbond introduces CUBE architecture for powerful Edge AI devices

Winbond Electronics Corporation has unveiled an enabling technology for affordable Edge AI computing in mainstream use cases.

Power
31st August 2023
Winbond and Mobiveil collaborate on low power applications

Winbond Electronics, a global supplier of semiconductor memory solutions, and Mobiveil, a fast-growing supplier of Silicon Intellectual Property (SIP), platforms, and IP-enabled design services, have announced a collaboration on a new IP controller targeting various applications such as automotive, smart IoT, industrial, wearables, TWS, wireless headsets, smart speakers, and connectivity.

Automotive
9th August 2023
Winbond ISO/SAE 21434 certification for W77Q Secure Flash

Winbond has announced that its TrustME W77Q Secure Flash family has received the prestigious ISO/SAE 21434 international standard certification.

Memory
21st July 2023
Winbond introduces the next generation 8Mb Serial Flash

Winbond Electronics, a global supplier of semiconductor memory solutions, has announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the requirement of connected IoT edge devices used in industrial and consumer segments.

Eco Innovation
3rd May 2023
Winbond sustainability initiatives and products

Winbond has announced the results of its sustainability performance along with aggressive goals and product development plans to expand that leadership in 2023.

News & Analysis
17th February 2023
Winbond joins UCIe Consortium to support chiplet interface standardisation

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology.

Sponsored
Sponsored
25th January 2023
How Secure are your Connected Devices? Preventing, Detecting and Recovering from Cyber-Attacks

Security in IoT devices is a growing concern. Reports show that in the first half of 2021, there were 1.5 billion attacks on IoT devices. The main reason for these attacks and subsequent data breaches is the lack of security.   Currently, only around 4% of deployed IoT products having adequate security in place. Winbond looks at how the security of connected devices needs to be based on software and hardware resilience to not only prevent...

Sponsored
Sponsored
9th January 2023
The growing concern of Security in IoT Devices: Preventing, Detecting and Recovering from Cyber-Attacks

Security in IoT devices is a growing concern. Reports show that in the first half of 2021, there were 1.5 billion attacks on IoT devices. The main reason for these attacks and subsequent data breaches is the lack of security. Currently, only around 4% of deployed IoT products having adequate security in place. Winbond looks at how the security of connected devices needs to be based on software and hardware resilience to not only prevent cyber-a...

Memory
18th November 2022
Winbond adopts Low Temperature Soldering (LTS) to slow the pace of global warming

Winbond Electronics Corporation announced that its Flash Memory products will now support the low temperature soldering (LTS) process, which reduces Surface Mount Technology (SMT) temperature from 220~260oC in the lead-free process to ~190oC.

Sponsored
Sponsored
20th October 2022
Winbond’s secure memory for connected devices – preventing, detecting, and recovering from cyber-attacks.

Security in IoT devices is a growing concern. Reports show that in the first half of 2021, there were 1.5 billion attacks on IoT devices. The main reason for these attacks and subsequent data breaches is the lack of security.   Currently, only around 4% of deployed IoT products having adequate security in place. Winbond looks at how the security of connected devices needs to be based on software and hardware resilience to not only prevent...

Automotive
8th September 2022
Winbond memory vendor receives ISO/SAE 21434 certification for Road vehicles

Winbond Electronics, a global supplier of semiconductor memory solutions, has announced that they had received the ISO/SAE 21434 certification from TÜV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world’s first memory vendor to receive the ISO/SAE 21434 standard certification for Road vehicles Cybersecurity Management System (CSMS).

Renewables
27th July 2022
Winbond’s LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation

Winbond Electronics Corporation has announced that its package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.

IoT
8th June 2022
Winbond TrustME W77Q Secure Flash Obtains SESIP Level 2

With SESIP level 2 certification, W77Q Secure Flash will provide connected devices with higher assurance by simultaneously requiring a vulnerability analysis and actual penetration testing on IoT platform design systems using Secure Flash to comply with security and functional safety standards.

IoT
17th April 2022
Double bandwidth for IoT applications with HYPERRAM 3.0

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in semiconductor, microelectronics and IoT solutions, have announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwidth HYPERRAM 3.0.  

Events News
28th October 2021
Challenges and Solutions for Code Storage Memory

On the 27th of October Winbond held a webinar on the challenges and solutions of AI & automotive for code storage memory this featured a presentation on a varitey of topics and a live Q&A with Erica Lee and Mick Elliott an editor at Electronic Specifier

Sponsored
Sponsored
15th October 2021
How can you achieve higher data thru-put rate for instant boot?

High performance memory is required for fast boot applications and better user experiences. Winbond will demonstrate several approaches to explain how to achieve higher data thru-put rate for instant boot and higher erase/program efficiency during OTA on AI and automotive application.Fast boot loaders for autonomous driving systems and instrument panel displays, AI training model and database storage systems, and over-the-air programming updates ...

Design
12th July 2021
Partnership accelerates embedded AI systems

Winbond Electronics has announced the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs). Customers of the RZ/A2M can benefit from Winbond’s long-term supply for various types of external memory, including DRAM, NOR Flash, and NAND Flash which are currently the mainstream of embedded systems.

Memory
22nd June 2021
SPI NOR Flash for 5G and high-end server applications

Winbond Electronics has announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR Flash that can support up to 166MHz standard/dual/quad SPI clocks.

IoT
24th March 2021
Cloud-to-device solution for over-the-air firmware updates

Winbond Electronics, Nuvoton, and Qinglianyun have introduced a fully integrated reference design for secure over-the-air (OTA) firmware updating of IoT devices which is secured from the cloud to the device’s code storage memory.

Memory
2nd February 2021
Winbond and Flex Logic collaborate for edge AI

Winbond Electronics has revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest in edge AI computing from Flex Logix for demanding Artificial Intelligence (AI) applications such as object recognition.

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