Winbond Electronics Corporation
Winbond Electronics Corporation Articles
Cloud-to-device solution for over-the-air firmware updates
Winbond Electronics, Nuvoton, and Qinglianyun have introduced a fully integrated reference design for secure over-the-air (OTA) firmware updating of IoT devices which is secured from the cloud to the device’s code storage memory.
Winbond and Flex Logic collaborate for edge AI
Winbond Electronics has revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest in edge AI computing from Flex Logix for demanding Artificial Intelligence (AI) applications such as object recognition.
Embedded 64Mb HyperRAM DRAM for AI edge computing
Winbond Electronics has announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform. GoAI 2.0 is a complete, new hardware and software solution for machine learning applications.
LPDDR3 DRAM in AI image-processing SoC
Winbond Electronics has announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).
W75F secure memory gets boosted safety credentials
Winbond Electronics has announced that its W75F, a Secure Flash memory device with Common Criteria EAL5+ certificate, has now achieved the ISO26262 ASIL Grade D safety certification. For automotive market, the W75F Secure Memory is compliant with the AEC-Q100 and is now officially certified ASIL-D.
Winbond QspiNAND Flash for 9205 LTE modem
Winbond Electronics has announced a new version of QspiNAND Flash designed for use with the Qualcomm(r) 9205 LTE Modem. The 1.8V, 512Mbits (64Mega Bytes) QspiNAND Flash from Winbond Electronics offers the right density for designers of New Cellular NB-IoT Modules.
Winbond launch of HyperRAM WLCSP for wearables
Winbond Electronics Corporation has announced the introduction of new HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applications. HyperBus technology was first published by Cypress in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus interface is the low pin count, which makes the circuit board layout simpler and the wiring area relative...
Sequential read function in high-speed QspiNAND Flash
Winbond Electronics has extended its record of innovation in specialty Flash memory with the introduction of a more flexible, high-speed read capability in its latest QspiNAND Flash products.
LPDDR3 DRAM memory from Winbond for AIoT
Winbond Electronics has revealed strong growth in opportunities for deployment of its innovative 1Gb LPDDR3 DRAM memory in a new generation of products which draw on new artificial intelligence (AI), display and Internet of Things (IoT) technologies.
Out-of-the-box solution for supply chain security
Winbond Electronics Corporation and Karamba Security have announced secure flash memory chips with integrated runtime integrity for automotive ECUs and IoT connected consumer, industrial devices and supply chain security.
Partnership for embedded cyber security
Secure-IC has announced a collaboration with Winbond to enhance embedded cyber security for software in automotive and other connected industries. Under the partnership, Secure-IC will offer an enhanced security platform that supports the whole security lifecycle in complementary fashion with the use of Winbond TrustME Secure Flash Memory.
Memory chips offer end-to-end security for IoT devices
The family of certified TrustME Secure Flash memory chips from Winbond Electronics has been extended with the W77Q series which targets IoT and smart connected consumer and industrial devices.
Winbond and Karamba Security partner for embedded cyber security
Karamba Security has announced a collaboration with Winbond Electronics Corporation to enhance embedded software security in automotive and other connected industries. OEMs and tier ones use Karamba’s embedded cyber security solutions for connected systems to protect their software and reduce vulnerability exposures.
HyperRAM addresses new AIoT application needs
With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand.
Compact dual-die memory chip supports NXP
Winbond Electronics has announced that its SpiStack dual-die NOR+NAND code storage product has been included on NXP Semiconductors FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.
Accelerated roll-out of 5G CPE modems with multi-chip package
Winbond Electronics has announced the launch of a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memory product in a compact 8.0x9.5x0.8mm multi-chip package (MCP). The new W71NW20KK1KW product, combines robust Single Level Cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory.
Reliable, lower cost alternative for automotive displays
The introduction of a High-Performance Serial NAND Flash memory IC has been announced by Winbond Electronics Corporation. The product offers a new high data-transfer rate of 83MB/s via a Quad Serial Peripheral Interface (QSPI).
NAND Flash provides new pathway to higher density code memory
At the recent embedded world exhibition, Winbond Electronics Corporation, a supplier of semiconductor memory solutions, unveiled a new class of NAND Flash ICs which offer high quality and long data retention suitable for use in mission critical code storage applications at densities of 512Mb (64MBytes) and above.