Companies

VadaTech Ltd

  • Ocean Village Innovation Centre, Ocean Way, Southampton
    SO14 3JZ
    United Kingdom
  • +44 2380 381982
  • http://www.vadatech.co.uk
  • +44 2380 381983

VadaTech Ltd Articles

Displaying 101 - 110 of 110
Boards/Backplanes
19th June 2014
New Data Processing Board Offered By VadaTech Features High Performance and Low Latency

VadaTech now offers a new data processor that meets the MicroTCA.4 specification with a rear I/O interface. The board is ideal for several High Energy Physics applications such as cavity field stabilization and standing-wave linear accelerators, as well as other systems requiring high speeds DSPs and low latency.      

Communications
18th June 2014
VadaTech quadruples transfer rate of AMC storage modules

VadaTech has upgraded its line of AMC Storage Modules with higher transfer rate, RAID and Host Bus Adapter options. The first in the line of upgraded storage AMCs is the AMC626.  The module meets the AMC.1 specifications for use in MicroTCA and AdvancedTCA systems.  It comes in the single module, mid-size and holds a 2.5 inch drive for SATA III at a 6 Gbps transfer rate or SAS-3 for a 12 Gbps transfer rate. 

Boards/Backplanes
17th June 2014
AdvancedTCA carrier board holds four AMCs

VadaTech has announced an AdvancedTCA (ATCA) carrier board that holds four Advanced Mezzanine Cards (AMCs). Designated the ATC133, this 10GbE Carrier features a 10G managed Layer 2 switch with a Xilinx Virtex-7 FPGA and a Crossbar Switch (CBS) which allows any combination of backplane ports to be routed to the FPGA.

Boards/Backplanes
28th May 2014
Shelf manager delivers 10x improvement over previous version

The VT003 shelf manager is the next generation of VadaTech's mezzanine-based shelf manager used in ATCA, MicroTCA, and other applications. The shelf manager provides a quad-core 1GHz per core processor, a 10x improvement over its previous version.

Analysis
7th May 2014
MicroTCA architecture chosen for NASA's terminal upgrading

The MicroTCA (μTCA) architecture, from VadaTech, has been chosen for the majority of NASA's ground terminal upgrading. Nasa is pgrading its ground terminals to modernize the communications infrastructure and provide new capabilities for their customers.

Enclosures
30th April 2014
8U chassis solves power redundancy problem

Introduced by Vadatech, the VT813 is an 8U chassis that is compliant with the MicroTCA.4 specification that offers N+1 redundant power to 4400W. MicroTCA.4 systems utilise double modules with an RTM connector for rear I/O. By adding RTM and higher power large modules, the overall power requirement in chassis are higher.

Boards/Backplanes
31st March 2014
FPGA Mezzanine Carriers are based on Xilinx FPGAs

  Based on Xilinx All Programmable FPGAs, VadaTech announces a full suite of Advanced Mezzanine Card (AMC) modules. These single-width AMCs are available in versions that include Virtex-5, Virtex-6, Artix-7, Kintex-7 and Virtex-7 FPGAs, as well as Zynq All Programmable SoCs, from Xilinx.

Communications
21st October 2013
6U ATCA shelf with switch cards and shelf managers

VadaTech has today introduced a new 6U ATCA shelf with integrated boards that combine the functionality of switch cards and shelf managers. In a typical Dual Star ATCA chassis, two slots are dedicated for the switches. With VadaTech’s VT830 6-slot ATCA shelf, the Switching Shelf Managers are below the card cage, this frees up those slots to be used as payload slots, providing six slots instead of the usual four.

Design
23rd July 2013
MicroTCA Advanced Mezzanine Card carrier for a FPGA Mezzanine Card

Vadatech has today announced a new Advanced Mezzanine Card carrier for a FPGA Mezzanine Card per VITA-57. The design allows users to utilize the popular FMCs within the AMC format of the MicroTCA architecture. Compliant to AMC.1, AMC.2, and AMC.4, the Vadatech AMC515 Carrier for FMC features a Virtex-7 chip in a 1925 package.

Communications
30th April 2013
VadaTech Supplies MicroTCA Cloud Computing Platform

VadaTech has started shipping a novel chassis designed specifically for application server platforms. As well as meeting the cost and reliability requirements of cloud computing, the chassis is carefully engineered for thermal performance.

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