The German DIE Bonder specialist Tresky has introduced a highly precise photonics bonder.

Soldering using formic acid vapour in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several products in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

Tresky GmbH is part of the ProMuPower project at Kiel University of Applied Sciences, which focuses on the development of high-performance power modules and the associated manufacturing processes.

Recently, the German DIE bonding specialist Tresky introduced the reliable pre-sintering process with copper pastes.

Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For this reason, Tresky has been working on this key technology for some time and will present further product and process innovations in 2023 as part of additional development steps.

In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in processed LEDs are immediately visible at first sight. This piece from Tresky discusses how its automated debonding solution can enhance LED manufacturing.

In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder. Often, the final design process has not yet been completed, so downstream changes to the product or even to the manufacturing processes may be necessary. Therefore, the Die-Bonder manufacturer Tresky GmbH from Berlin now offers contract manufacturing of prototypes and small series.