Toshiba Electronics Europe

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Toshiba Electronics Europe articles

Displaying 1 - 20 of 553

New solution for storing high volume data cost efficiently

New solution for storing high volume data cost efficiently
Toshiba Memory Europe has announced a range of four new JEDEC e-MMC (Embedded MultiMediaCard) Ver. 5.1 compliant embedded flash memory products for consumer applications. The new products integrate Toshiba Memory’s 15nm BiCS FLASH 3D flash memory and a controller in a single package. All of the new products support the command queuing and secure write protection functions, specified as an option in the standard.
18th March 2019

NVMe SSD portfolio targets cloud data centres

NVMe SSD portfolio targets cloud data centres
The availability of the XD5 Series NVMe SSD platform in a 2.5” low-profile form factor that is optimised for low-latency and performance consistency in read-intensive workloads, has been announced by Toshiba Memory Europe. Developed for both data centre and cloud environments, the new 2.5” form factor XD5 Series is suited for NoSQL databases, large-scale-out data mining and analysis, and streaming applications.
15th March 2019

Collaboration to provide in-car data centre services

Collaboration to provide in-car data centre services
It has been announced that Toshiba Memory Europe and OSR Enterprises (OSR), creator of the EVOLVER automotive platform, will extend their collaboration on OSR’s in-car Datacenter to enhance live data management and logging in cars. The cooperation will combine technical know-how and hopes to create a ‘Datacenter on Wheels’ with high-density and low-power solid state drives.
25th February 2019


How memory improvements will expand embedded storage

How memory improvements will expand embedded storage
With mobile product shipments, dominated by smartphones, continuing to account for a significant amount of the non-volatile memory (NVM) market, suppliers and standardisation organisations are working hard to ensure that next-generation NVMs keep up with the demands placed upon them.  Author: Axel Stoermann, Toshiba Memory Europe 
4th February 2019

Storage SSDs at embedded world 2019

Storage SSDs at embedded world 2019
At embedded world 2019, Toshiba Memory Europe will be exhibiting, where they will highlight the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their 96-layer, BiCS FLASH 3D flash memory.
30th January 2019

Embedded flash memory enables faster performance for smartphones

Embedded flash memory enables faster performance for smartphones
Toshiba has started sampling the 128GB version of the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilises the company’s 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems.
23rd January 2019

Single package PCIe with 96-layer 3D Flash memory

Single package PCIe with 96-layer 3D Flash memory
The introduction of the fourth generation of Toshiba Memory’s single package ball grid array (BGA) solid state drive (SSD) BG4 series was announced at CES 2019. Toshiba Memory’s new line-up of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centres.
17th January 2019

16TB enterprise capacity hard disk drives

16TB enterprise capacity hard disk drives
A new series of enterprise capacity hard disk drives has been announced by Toshiba Electronics Europe with the MG08 Series. The series is a large capacity 16TB Conventional Magnetic Recording (CMR) HDD. The product has 33% more capacity than today’s widely adopted 12TB drives, and 14% more capacity than prior 14TB models.
8th January 2019

H-bridge driver IC supporting low-voltage, large current drive

H-bridge driver IC supporting low-voltage, large current drive
An addition to Toshiba Electronics Europe’s (Toshiba) line-up of dual H-bridge driver ICs for DC brushed motors and stepping motors has been launched. The new TC78H653FTG delivers the low voltage (1.8V) and high current (4.0A) essential for motor-based equipment powered by dry-cell batteries such as mobile devices, electronic products for the home and USB drives. 
14th December 2018

Development platform delivers custom solutions

Development platform delivers custom solutions
The first customer shipment of a new 130nm manufacturing process node based FFSA (Fit Fast Structured Array) development platform, has been announced by Toshiba Electronics Europe (Toshiba). This innovative high performance System-on-Chip (SoC) development platform delivers custom solutions that feature low power consumption at a low cost point.
22nd November 2018

Flash memory technology advances at electronica 2018

Flash memory technology advances at electronica 2018
At this year’s electronica show, Toshiba Memory Europe will be exhibiting a number of their latest innovative products and technologies for embedded Flash memory for the industrial, consumer and automotive sector, as well as a selection of new client solid state drives (SSD) for mobile computing, datacentre use and client PCs.
16th October 2018

Power amplifier designed for automotive audio systems

Power amplifier designed for automotive audio systems
  A new 4-channel power amplifier from Toshiba Electronics has been launched. It is designed for automotive audio applications that is highly resistant to the power surges typically found within vehicle electronics.
26th September 2018

H-bridge motor drive IC supports low voltage and high current drive

H-bridge motor drive IC supports low voltage and high current drive
  The launch of a new dual H-bridge driver IC for DC brushed motors and stepping motors has been announced by Toshiba. The TC78H651FNG delivers performance at a low voltage (down to 1.8V) and high current (up to 1.6A) that is essential for equipment powered by dry-cell batteries. 
11th September 2018

Automotive 40V ultra low RDS(ON) MOSFETs in 5mm x 6mm packages

Automotive 40V ultra low RDS(ON) MOSFETs in 5mm x 6mm packages
Toshiba Electronics Europe has announced the launch of “TPWR7940PB” and “TPW1R104PB”, 40V N-channel power MOSFETs using DSOP Advance (WF) packages with double-sided cooling capability. The TPWR7940PB is a 40V max 0.79mΩ MOSFET in DSOP Advance(WF)L package, and the TPW1R104PB is a 40V max 1.14mΩ MOSFET in DSOP Advance(WF)M package. Both devices are based upon the latest trench structure U-MOSIX-H process and are AEC-Q101 qualified.
4th September 2018

Hard disk drives help SAS-based cloud-scale storage platforms

Hard disk drives help SAS-based cloud-scale storage platforms
Toshiba Electronic Europe (Toshiba) has announced its new Enterprise Capacity 14TB and 12TB helium-sealed SAS HDD models. The MG07SCA Series features 7,200rpm performance, a SAS 12Gbit interface, and Advanced Format Sector Technology.
29th August 2018

High-definition microstepping motor driver

High-definition microstepping motor driver
A new 50V/5A rated bipolar stepping motor driver that supports 1/128 microstepping has been announced by Toshiba Electronics Europe (Toshiba). The new TB67S128FTG meets the often conflicting requirements of high speed, high performance and reduced power consumption.
23rd August 2018

Next-gen superjunction power MOSFETs support drain currents

Next-gen superjunction power MOSFETs support drain currents
  Toshiba Electronics has launched a new series of next-gen 650V power MOSFETs that are intended for use in server power supplies in data centres, solar (PV) power conditioners, Uninterruptible Power Systems (UPS) and other industrial applications.
22nd August 2018

High-speed MCUs with multiple packages and memory sizes

High-speed MCUs with multiple packages and memory sizes
Toshiba has announced the launch of the second M3H group in the TXZ family of low-power, high-speed microcontrollers based on the Arm Cortex-M3 core. Toshiba launched the first M3H Group with 30 products for consumer and industrial device applications in May 2016, as the first group in the TXZ family. The newly launched second M3H group is again based on the de facto industry standard Arm Cortex-M3 core for embedded systems and offers greater performance than the first group.
16th August 2018

Industry’s first SSD using 96-layer 3D flash memory

Industry’s first SSD using 96-layer 3D flash memory
Toshiba Electronics Europe has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer, BiCS FLASH 3D flash memory. Reportedly the first SSD to use this technology, the new XG6 series is targeted to the client PC, high performance mobile, embedded, and gaming segments, as well as datacentre environments for boot drives in servers, caching and logging, and commodity storage. 
10th August 2018

UL 508 certification for eight photorelays obtained

UL 508 certification for eight photorelays obtained
It has been announced that Toshiba Electronics Europe (Toshiba) has obtained approval to the industrial safety standard UL 508 and the UL product category NRNT for a total of eight photorelay products. The devices are also UL 1577 compliant and approved for use as industrial control switch and as solid state control devices for non-motor rated loads. 
6th August 2018


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