Teledyne Technologies

Teledyne Technologies Articles

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27th April 2020
High speed data conversion platform to accompany FPGAs

Teledyne e2v has announced its development of a high speed data conversion platform to accompany latest Xilinx FPGAs.

Mixed Signal/Analog
23rd April 2020
Board-level hardware enables preemptive experimentation

Teledyne e2v is set to further expand its portfolio of Digital-to-Analogue Converter (DAC) ICs and through availability of an accompanying evaluation platform, engineers will be able to begin applying it to their design projects soon. The company is about to start initial sampling of the EV12DD700 dual-channel DACs, which are capable of operating up into Ka-band frequencies.

6th June 2018
Teledyne e2v receives aerospace certification

Teledyne e2v is the first semiconductor manufacturer in Europe, and only third in the world, to be awarded the site level MIL-PRF-38535 Class Y certification from the DLA. Also known as QML Class Y, the certification is recognised as the highest guarantee of quality and reliability for ceramic, non-hermetically sealed Flip-Chip microcircuits for aerospace and defense (A&D) applications. In addition to QML Class Y, Teledyne e2v has also been a...

Events News
28th April 2017
SP Devices is now part of Teledyne Technologies

With the acquisition of e2v by Teledyne Technologies, a provider of instrumentation, digital imaging products and software, aerospace and defence electronics, and engineered systems, has announced that SP Devices is now operating as a part of the instrumentation segment of Teledyne under the brand name of Teledyne SP Devices.

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