TDK Corporation announces the introduction of the TDK-Lambda RFE1600 series of front end power supplies – 1.6kW 1U high units for stand alone and distributed power architecture (DPA) applications requiring reliable 12V, 24V, 32V and 48V bulk power in the communications, test and industrial markets.

TDK Corporation has expanded the proven EPCOS B84771* IEC inlet filter series with two new series: The B84773* series features an integrated fuse, while the B84776* series has both a switch and a fuse. All series are also available as versions for medical applications with a maximum leakage current of 2 µA. This makes them particularly suitable for applications for which a minimized leakage current is important.

TDK Corporation presents EPCOS MKP film capacitors of the B3267xPx series with a significantly reduced volume. For example the type with a capacitance of 1 µF and a rated voltage of 450 V DC has dimensions of only 8.0 x 17.5 x 13.0 mm³ thanks to a high capacitance density with a lead spacing of 10 mm. This corresponds to a volume reduction of around 40 percent compared with the predecessor type with a lead spacing of 15 mm.

TDK has unveiled a new series of highly integrated, multi-channel power management modules for smartphones and tablets. Based on TDK’s SESUB technology (semiconductor embedded in substrate), the new module is the world’s first IC embedded power management module for smartphones and tablets. Aimed at reducing lead times and development costs for manufacturers of smartphones and tablets, the new product features a power supply management IC chi...

TDK Corporation has expanded its CKG series of MEGACAP Type MLCCs to include miniature 1608 to 3216 (EIA 0603 to 1206) packages. Until now these MLCCs were available only in 3225 to 5750 packages (EIA 1210 to 2220). With dimensions of only 1.9 x 1.3 x 1.5 mm³ the new 1608 components are the world’s smallest automotive-grade MLCCs in the mega cap class.

TDK Corporation presents the new CGA1 series of 0603 (EIA 0201) MLCCs for use in automotive electronics applications. With dimensions of only 0.6 x 0.3 x 0.3 mm³, the new components offer rated voltages from 6.3 V to 50 V, thus including the world’s first 0603 X7R MLCC with a rated voltage of 50 V. The 0603 package is the smallest used by the automotive industry.

TDK Corporation announces that its subsidiary, EPCOS Brazil, was presented with Siemens’ Diamond Prize in the category ”Industry Sector,” the company’s highest supplier award. The prize honours EPCOS’ outstanding performance in terms of product quality, value for money, logistics, punctual and on-time delivery and customer service.

TDK has developed the YNA15 series of noise absorbers in case size 1005 to suppress voltage ringing that can be caused by switch-mode power supplies. The new TDK noise absorbers have a rated voltage of 25 V and a rated capacitance of 0.1 µF. Depending on the type, the YNA15 series features ESR values of between 50 mΩ and 1 Ω. When the new component is used on the input side of the SMPS, for example, EMI noise caused by voltage ringing ...

TDK Corporation has developed the CJA series of TDK SRCT capacitors in case size 0603 (EIA 0201). Compared to existing multilayer ceramic capacitors of the same case size, the mounting footprint has been reduced by 50 percent. In this TDK-developed design with bottom terminals, a solder resist prevents wetting of the face and side areas of the MLCCs with solder.

TDK Corporation offers two new 105 °C snap-in series of EPCOS aluminium electrolytic capacitors with a very high ripple current capability and a longer useful life. The latter is 5000 h for the B43545 series. These capacitors are available with rated voltages of 400 V DC and 450 V DC as well as capacitances of 82 µF to 820 µF.

TDK Corporation presents the new highly integrated EPCOS D5058 front-end module for smartphones. In addition to the conventional GSM bands at 850, 900, 1800 and 1900 MHz, it also covers WCDMA bands 1, 2, 4 and 5, as well as LTE bands 2, 4, 5 and 17.

TDK Corporation presents the new EPCOS C914 MEMS microphone. It offers a particularly high signal-to-noise ratio of 65 dB(A) in the frequency range from 20 Hz to 20 kHz. It is thus particularly suitable for demanding audio applications in smartphones.

TDK Corporation presents the two new EPCOS C920 and C923 MEMS microphones. With footprints of only 2.75 x 1.85 mm² each and an insertion height of 0.9 mm, they are among the smallest top-port microphones worldwide.

TDK Corporation presents the EPCOS CeraLink, an innovative DC link capacitor for frequency converters. CeraLink is based on a PLZT ceramic material and covers a capacitance range from 1 µF to 100 µF at a rated voltage of 400 V DC. Another type has a rated voltage of 800 V DC and a capacitance of 5 µF.

TDK Corporation has extended the range of EPCOS aluminum electrolytic capacitors by types with higher rated voltages. For the screw terminal types in the new B43700* and B43720* series, the previous rated voltage of 550 V DC has been raised to 600 V DC. These capacitors cover a capacitance range from 1200 µF to 6800 µF and are designed for temperatures up to 85 °C.

TDK has developed the GBDriver RS4 series of NAND type flash memory controllers with support for 3 Gbps serial ATA. Sales will begin in January 2013. With an effective access speed of 180 MB/sec, the GBDriver RS4 is an advanced high-speed SATA controller chip.

TDK Corporation presents a new MLCC in size 0402 (IEC) with the highest rated capacitance of 0.22 µF*. The TDK C0402 is designed for decoupling applications in compact mobile devices such as smartphones. With its rated voltage of 6.3 V, the capacitor is suitable for any voltage present in such applications.

Welcome to TDK at electronica 2012 in Munich! we will be showing our innovative and comprehensive range of EPCOS and TDK products for the entire spectrum of electronics applications.

TDK Corporation has extended its product range of EPCOS multilayer varistors with the new E series, which is designed to assure protection from current surge pulses in automotive electronics. Thanks to their innovative glass passivation, the SMD protection components that are qualified to AEC-Q200 with an extended stress test are even more rugged and reliable than before.

TDK has developed four new series of miniature, low-profile thin-film metal power inductors featuring up to twice the rated current and half the DC resistance of comparable ferrite inductors. The new TDK TFM family is available in four form factors, including IEC 1608, which at 1.6 x 0.8 x 1.0 mm3 is the world’s smallest metal power inductor.