STMicroelectronics
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STMicroelectronics Articles
STMicroelectronics Publishes Corporate Responsibility Report for 2009
STMicroelectronics (NYSE: STM), one of the world’s leading semiconductor manufacturers, has published its Corporate Responsibility Report for 2009. The report demonstrates how ST creates value for its stakeholders through its culture of Sustainable Excellence and has maintained its commitment to Corporate Responsibility despite the economic crisis.
IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics
IBM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) said today that the four companies are collaborating to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance.
STMicroelectronics and Debiotech Debut Disposable Insulin Jewel Pump at ADA Congress in US
Debiotech and STMicroelectronics (NYSE: STM) today announced that they will publicly showcase their novel insulin “Jewel Pump” at the Debiotech stand at the American Diabetes Association 70th Scientific Sessions (June 25-29) in Orlando, Florida. Representing the most advanced use of microfluidic MEMS (Micro-Electro-Mechanical Systems) technology in diabetes treatment, the tiny device, for which FDA clearance is now pending, can be mounted on...
STMicroelectronics Enhances Current Sensing for Improved Control, Efficiency and Safety
STMicroelectronics has unveiled a chip that simplifies the design of power management, monitoring and safety equipment by allowing direct and accurate measurement of current in power lines operating at up to 70V.
STMicroelectronics and Tsinghua University Announce Long-Term Strategic R&D Partnership
STMicroelectronics and Tsinghua University, Shenzhen Graduate School, have reached a long-term strategic research partnership agreement. This agreement is the second phase of a collaboration that began in 2002 with the setup of a joint ASIC (Application Specific Integrated Circuit) research center.
European Research Project Aims for Greener Electronics
The partners in a new publicly-funded research project today announced details of the multinational/multidisciplinary program: “END — Models, Solutions, Methods and Tools for Energy-Aware Design.” This three-year ENIAC (European Nanoelectronics Initiative Advisory Council) project is designed to enhance the competitiveness of Europe’s semiconductor and electronics equipment companies in developing new products and technologies that are at...
STMicroelectronics Frees Space for More Features in Multi-Function Handhelds
STMicroelectronics has introduced a device that provides an extra channel of ESD (Electro-Static Discharge) protection within the same dimensions as competing alternatives — 25% more channels to deliver a space-efficient solution for designers of feature-rich, tightly packed portable gadgets such as netbooks and smartphones.
STMicroelectronics Frees Space for More Features in Multi-Function Handhelds
STMicroelectronics has introduced a device that provides an extra channel of ESD (Electro-Static Discharge) protection within the same dimensions as competing alternatives — 25% more channels to deliver a space-efficient solution for designers of feature-rich, tightly packed portable gadgets such as netbooks and smartphones.
STMicroelectronics Innovation Recovers Power Lost Due To Solar-Panel Variability
STMicroelectronics has unveiled the industry’s first IC to combine important power-optimization and power-conversion functions for solar generators. ST’s innovation will allow multi-panel arrays, ranging from domestic rooftop-type equipment to larger installations, to deliver more energy at a lower cost per Watt.
STMicroelectronics Miniaturizes Digital Temperature Sensors for Protection of Portable Products
STMicroelectronics has announced a super-small and power-efficient temperature sensor allowing portable devices to benefit from features such as intelligent thermal protection. As today’s consumer lifestyles demand unprecedented performance and portability from products such as solid-state drives, notebook computers, eREADERS, smartphones, basestations and digital signage, hard-working electronics are packed into confined spaces and generate h...
STMicroelectronics: Tomorrow’s TV is 3D, Connected and Green
STMicroelectronics will speak at the COMPUTEX Taipei - CTO Forum about the Company’s world-class solutions for digital TV and multimedia services across all consumer devices. ST’s newest chips are designed to lead the way for greener consumer electronics equipment, power new Internet-based services, and enable exciting user experiences, including 3D HDTV.
STMicroelectronics Extends Class-D Amplifier Portfolio, Enabling High-End Home Multimedia to Look as Good as it Sounds
STMicroelectronics has announced production availability of an analog-input 2x100W class-D power amplifier. This high-end amplifier extends the company’s range of class-D devices that deliver audiophile sound quality in components smaller than competing devices by using an advanced chip manufacturing process.
NXP, STMicroelectronics, Trusted Logic and Stollmann to Promote Hardware-Independent NFC API for Android™
NFC vendors STMicroelectronics and NXP today announced, in conjunction with Trusted Logic and Stollmann, that the companies are to promote a common hardware-independent API (Application Programming Interface) for NFC (Near Field Communication) applications on mobile phones and other devices running Android™.
STMicroelectronics Expands its SPEAr Microprocessor Family for High-Performance Applications
STMicroelectronics revealed the new architecture that will be the backbone for the new members of its popular SPEAr® (Structured Processor Enhanced Architecture) family of embedded microprocessors, targeting high-performance connectivity and embedded applications.
STMicroelectronics Shrinks Next-Generation Bluetooth Designs by Connecting the Antenna Through a Single Chip
Two new ICs from STMicroelectronics allow designers to connect an antenna to a Bluetooth transceiver using a single chip, making Bluetooth-enabled products simpler, smaller and easier to build. The BAL-2593D5U and BAL-2690D3U are integrated baluns, used to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver. As replacements for traditional baluns built with discrete components, the new devices occupy ...
STMicroelectronics Shrinks Next-Generation Bluetooth Designs by Connecting the Antenna Through a Single Chip
Two new ICs from STMicroelectronics allow designers to connect an antenna to a Bluetooth transceiver using a single chip, making Bluetooth-enabled products simpler, smaller and easier to build. The BAL-2593D5U and BAL-2690D3U are integrated baluns, used to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver. As replacements for traditional baluns built with discrete components, the new devices occupy ...
STMicroelectronics Announces Volume Production of STM8L Ultra-Low-Power Microcontrollers Enabling Smarter Energy-Saving Designs
STMicroelectronics has announced full production of the STM8L ultra low-power microcontroller family. Unveiled in late 2009, the new family features EnergyLite technology to minimize power consumption in all operating modes.
STMicroelectronics Announces 32nm Design Platform for Next-Generation System-on-Chip ICs for Networking Applications
STMicroelectronics announced full availability of a 32-nanometer (nm) technology platform for the design and development of leading-edge application-specific integrated circuits (ASICs) for networking applications. Central to the new 32nm SoC design platform, which implements ST’s 32LPH (Low-Power High-performance) process technology, is the industry’s first Serializer-Deserializer (SerDes) IP available in 32nm ‘bulk’ silicon.
STMicroelectronics’ Newest 3-Axis Accelerometer
STMicroelectronics has extended its motion-sensor portfolio with a 3-axis digital-output accelerometer that combines a drastically reduced power consumption – 90% lower than available solutions on the market - with miniature footprint and enhanced functionality.
STMicroelectronics and Micropelt Demonstrated ‘Perpetual Energy’ Thermoharvesting Power Supply
STMicroelectronics and Micropelt GmbH, a young German company specializing in novel thin film thermoelectric devices, have announced a jointly-developed autonomous wireless sensor evaluation kit. The TE-Power NODE evaluation kit combines Micropelt’s Thermogenerator and ST’s EnFilm™ solid-state thin-film battery as energy storage for power backup and pulse current. Power management and charge monitoring circuitry connect to the included grap...