A compact, lightweight, inline 3D-CT automated X-ray inspection machine, the 3Xi-M110, for inspection of printed circuit board assemblies (PCBAs) will be demonstrated at productronica in Munich (November 12-15) by Saki Corporation. The 3Xi-M110 reduces the dose and exposure to X-rays during inspection and features new soldering quality inspection functions for PCB assembly applications.

At NEPCON China on 25th-27th April 2017 at the Shanghai World EXPO Exhibition and Convention Center in Shanghai, China, on booth 1J25, Saki will demonstrate the advanced capabilities and new Extra Component Detection (ECD) feature of its BF-3Di 3D Automated Optical Inspection (AOI) systems. 

Saki will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full ...

Saki Corporation has said it will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China. Saki's AOI systems' Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. 

Saki Corporation has said it will present its 3D automated optical inspection equipment with side-angle cameras and ring lighting technology at NEPCON Thailand 2016 in Bangkok. Saki's 2D AOI system for simultaneous double-sided PCB inspection will also be on display.

Saki Corp is set to present its 2D and new 3rd generation 3D automated optical inspection (AOI) systems at NEPCON China 2016. The company will make available experts to discuss the factors to consider to determine the correct AOI system for specific inspection and measurement needs.

Saki Corporation will demonstrate 2D and 3D automated optical inspection (AOI) systems at NEPCON Korea 2016. Technical experts will help assess the correct AOI solution for specific inspection and measurement needs.

Saki America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%.

Saki Corporation  will debut its 3rd generation 3D automated optical inspection line that accommodates dual lanes, XXL sizes, and increases throughput by 15%, at NEPCON Japan - booth E17-46.

Automated optical inspection specialist Saki will show its new 3D automated optical inspection, solder paste, and x-ray technology equipment at Productronica 2015 with the theme “From Inspection to Measurement.”

Saki announces presentations of its true 3D AOI and measurement equipment at the Surface Mount Technology International (SMTAI) show, being held in Rosemont, IL from 29th to 30th September 2015 at booth 1025. Saki's BF-3Di AOI System doesn't just inspect, it provides measurements of each component for heights from 0 to 20mm, with 1µm height resolution.

Saki announces two informative demonstration sessions to help attendees better understand 3D AOI technology and systems. The demonstrations are being held at Saki's new location in Fremont, California on 10th August, 2015. Individual private demonstrations can be scheduled for 11th to 21st August, 2015.

  Saki will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at this years SMT Hybrid Packaging, at Stand 7-331. Saki's BF-3Di and BF-3Si are true 3D algorithm-based inspection systems with 1μm resolution.