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Memory
12th May 2020
Picosun and IME to create high performance memory

Picosun Group, provider of the AGILE ALD (Atomic Layer Deposition) thin film coating solutions for global industries, and A*STAR’s Institute of Microelectronics (IME), Singapore, have strengthened their collaboration in next generation high performance memory technologies.

Component Management
13th November 2019
Biocompatible ALD materials for medical applications

Picosun has expanded its selection of biocompatible ALD materials to be used in medical applications. HfO2, SiO2, ZrO2, Nb2O5, Ta2O5, AlN and TiN ALD films manufactured by Picosun have been tested and validated by an independent third party to be non-cytotoxic and safe to human tissues in, for example, implant applications.

Analysis
3rd June 2019
Strengthening presence in the healthcare industries

Global provider of AGILE ALD (Atomic Layer Deposition) thin film coating solutions, Picosun Group, has announced that it is continuing its presence in healthcare industries by supplying ALD technology to produce bioactive coatings on surgical implants at a major manufacturer.

Optoelectronics
23rd April 2019
Micro-LEDs achieve superior brightness with ALD technology

Supplier of AGILE ALD (Atomic Layer Deposition) thin film coating solutions, Picosun, has reported good results in boosting micro-LED performance using ALD passivation. Micro-LEDs are a strong challenger to existing display technologies such as LCDs (liquid crystal displays), OLEDs (organic light-emitting diodes) or conventional LEDs (light-emitting diodes). 

Component Management
14th February 2019
ALD encapsulation prevents electronics degradation

Supplier of ALD (Atomic Layer Deposition) thin film coating solutions, Picosun Group, has reported unprecedented results in high reliability electronics protection with ALD. Hermetic encapsulation by ALD nanolaminates developed by Picosun has been proven to block tin whisker formation on PCB (printed circuit board) assemblies completely. 

Test & Measurement
20th December 2013
ALD equipment users in next generation 3D capacitors

SiSTEM Technology says that the Atomic Layer Deposition (ALD) equipment it supplies from Picosun is being used in the fast, cost-efficient mass production of next generation 3D capacitors, as part of an EU development programme. These devices will be suitable for use, for example, in pacemakers and other implantable medical devices, electric cars, and highly efficient memories for computers and mobile devices.

Component Management
9th April 2013
Picosun’s high performance 300-mm ALD cluster tool enters new generation memory market

Picosun reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications. The 300 mm cluster design is based on the company’s long-term top product, the fully automated, multifunctional PICOPLATFORM ALD deposition unit for parallel, simultaneous execution of several different processes for high-k and metal/metal nitride films.

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