NXP Semiconductors announced its new NXP analogue front-end (N-AFE) family for high-precision data acquisition and condition monitoring systems for factory automation. Designed as software-configurable universal analogue input devices, the new N-AFE family helps enable the software-defined factory, making it easier for operators to configure a smart factory and adjust settings based on shifting market needs.

AI-powered digital twin models in the cloud aim to improve EVs battery range, efficiency, safety, and lifetime and herald multiple new applications.

NXP Semiconductors has announced the MCX N94x and MCX N54x, the first families in the N series of the new MCX microcontroller portfolio.

NXP Semiconductors has announced its collaboration with the German Aerospace Centre (DLR) and other partners on ion trap-based quantum computers as part of the DLR’s Quantum Computing Initiative.

NXP Semiconductors has announced MatterTM-enabled development platforms that simplify and accelerate the creation of Matter devices for smart homes and buildings.

NXP Semiconductors has announced the OrangeBox automotive-grade development platform, which integrates a wide variety of NXP wireless technologies, from broadcast radio, Wi-Fi 6 and Bluetooth, to secure car access with Ultra-Wideband (UWB) and Bluetooth Low Energy (BLE), and 802.11p-based V2X.

NXP collaborates with Bosch Sensortec for this year’s hands-on coding and hardware challenge, inspiring developers to create innovative drone and rover solutions to help balance our food ecosystem.

Building on the market success of its existing radar transceivers, NXP’s next-gen RFCMOS radar transceivers are now in production.

The software jointly developed with Elektrobit aims to reduce the entry-level cost of battery management system (BMS) development and enhance ease-of-use of NXP’s high-voltage BMS reference design (HVBMS RD).

NXP Semiconductors has announced the NCJ37x Secure Element (SE), an automotive-qualified secure microcontroller with advanced cryptographic accelerators and physical built-in electrical attack resistance for various security-critical automotive applications such as smart access key fobs, Qi 1.3 authentication or car-to-cloud communication.

NXP Semiconductors has signed a memorandum of understanding with Hon Hai Technology Group ('Foxconn') to jointly develop platforms for a new generation of smart, connected vehicles.

NXP Semiconductors has announced that its WLAN7207H 2.4GHz front-end integrated circuit (FEIC) enables Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone.

NXP Semiconductors announced its collaboration with Plug and Play’s flagship Open Innovation Platform STARTUP AUTOBAHN at their EXPO 2022.

NXP Semiconductors has announced that it is working with ING Bank N.V. on Project NEAR, ING’s pilot of UWB-based peer-to-peer payment application.

At embedded world 2022, Electronic Specifier's Editor, Mick Elliott, speaks with Brian Carlson, Director, Global Product and Solutions Marketing at NXP Semiconductors about its launch of two automotive processors at the show.

NXP Semiconductors N.V. has announced two processor families that extend the benefits of NXP’s innovative S32 automotive platform with safe, high-performance real-time processing.

NXP Semiconductors has announced the MCX portfolio of microcontrollers, designed to advance innovation in smart homes, smart factories, smart cities and across many emerging industrial and IoT edge applications.

The flexible, modular i.MX RT Industrial Drive Development Platform is designed to advance smart, secure industrial IoT applications with multi-motor control, deterministic communications and a foundation for industrial cybersecurity.

Industry’s first single-chip solution to combine ultra-wideband (UWB) radar and fine ranging capabilities to enable high motion sensitivity for presence detection, vital signs monitoring and gesture recognition.

NXP Semiconductors has announced that its SN110 convergence eSIM solution powers the Xiaomi Redmi Note 10T smartphone.