Through expanding its zSFP+ Interconnect System to support 56Gbps PAM-4 channels in a stacked 2xN port configuration, Molex is allowing next-gen Ethernet and fibre channel applications to receive signal integrity. OEMs requiring high-density interconnect applications now have the ability to utilise channels with individual lane data rates up to 56Gbps PAM-4 in a stacked 2xN configuration.

The SFP-DD MSA Group has announced intent to develop the specification for a high-speed, double-density SFP-DD interface. Under the MSA, participating companies will address the technical challenges of achieving a double-density SFP interface and ensuring mechanical interoperability for module components produced by different manufacturers. New SFP-DD based networking equipment will support legacy SFP modules and cables, as well as new double den...

Expanded availability of Molex's web-based product environmental and regulatory information has been announced. The new Molex online tool allows a user to select and download industry product compliance documents, including IPC Class C, IPC Class D and comprehensive Product Compliance Declarations, together with EU RoHS, REACH SVHC and Low-Halogen Statements for multiple products.

Global manufacturer of electronic solutions, Molex, has launched the next-gen of high-performance HOZOX HF2 EMI (electromagnetic interference) Noise Absorption Sheets designed to wrap around cable and other high frequency devices. The pliable composite sheets feature magnetic and conductive properties that provide superior EMI noise absorption performance up to 40GHz.

  Molex has introduced Micro-Fit TPA Single- and Dual-Row Receptacles and Cable Assemblies designed to prevent failures due to terminal back-out and provide a secondary terminal retention feature.

Molex, together with MB Connect Line, has introduced a secure and reliable cloud-based communication channel that allows remote access and monitoring. With data transparency becoming increasingly important, this platform adds communications and networking to the production process, offering machine and system builders’ capabilities designed to enable real-time condition monitoring and predictive maintenance, supporting the drive towards sma...

Two types of cables from Flamar, a Molex company, have achieved new approvals which expand the potential use in food & beverage and industrial automation. Weld-Slag and Oil-Resistant (WSOR) cables from Flamar are now compatible with Ecolab products. The cables underwent through tests at Ecolab laboratories, including multiple weeks of being exposed and immersed in detergents and disinfectants used across the world in the food and beverage ind...

With the addition of 8X cables and XD (eXtra Durable) vertical board mounted connectors, Molex has expanded its Nano-Pitch I/O Interconnect System portfolio. Delivering data speed rates of 25Gbps per lane, the Nano-Pitch I/O 8X Interconnect System offers what Molex claims to be industry-leading port density and multi-protocol support to internal storage, server and mobile/enterprise applications. The XD board receptacles are offered as both ...

With Hannover Messe 2017 in progress, Molex, Phoenix Contact, Murrelektronik and Binder, specialists in the field of M12 connection technology, has announced a cooperation agreement to drive the standardisation of M12 push-pull connectors.

  The Molex Brad Ultra-Lock system is designed to bring the ease of a push-pull connector to IP67/IP68/IP69K rated sealed connections in industrial environments. The M12-compatible Brad Ultra-Lock technology provides a seal that surpasses the performance and reliability of traditional threaded connectors.

    Molex will present interconnect solutions, as part of its platform for industrial automation, to help customers address Industry 4.0 applications at Hannover Messe 2017 (Hall 9, Stand F76).

    Molex will focus on next gen cabin network systems at the Aircraft Interiors Expo to be held at 4th to 6th April in Hamburg, Germany.

Molex has introduced its µPDB custom sealed modules which are suitable for customers looking to add or relocate power switching and circuit protection in vehicles. Fully customised to customers’ needs, the modules utilise only the specific components and materials needed for the application.

  Molex has announced a strategic collaboration and investment in Excelfore. Headquartered in Fremont, CA with offices in China, Germany, India and Japan, Excelfore specialises in middleware solutions for smart mobility networks that support next-generation smart, autonomous and learning vehicles, fleets and associated infrastructure.

Molex has released the Impact zX2 Backplane Connector System, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilises Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data rate requirements can now do so without making major revisi...

Combining QSFP+, Impel or near-ASIC (Application Specific Integrated Circuit) connectors with thin twinax cables, Molex has introduced its BiPass I/O and Backplane Cable Assemblies. The BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112Gbps PAM-4 (pulse-amplitude modulation) protocol.

In order to provide cost-effective, reliable sealed performance, Molex has introduced the ValuSeal Wire-to-Wire connector system. The IP65-rated, integrated wire-and-ring seal system is capable of 11A power, suitable for consumer, non-automotive transportation and lighting applications. 

  The Impulse Orthogonal Direct Backplane Connector System has been introduced by Molex. It is designed for high-density data centre applications and also supports data rates of 56Gbps NRZ and 112Gbps PAM4 with superior signal integrity.

Molex has introduced Nano-Fit Power Connectors, which provide terminal protection with what the company claims to be the smallest fully isolated terminal power connector in the market. In addition, keying options ensure proper mating and a Terminal Position Assurance (TPA) feature virtually eliminates terminal backout.

A Dual Source Alliance (DSA) agreement has been announced between Molex and TE Connectivity (TE) to produce a new generation of high-speed Input/Output (I/O) and backplane connectors, and cable assemblies for data communications applications.