Mentor Articles

Displaying 1 - 20 of 26
11th August 2020
EDA software support for 5/4nm process technologies

Mentor has announced that Calibre nmPlatform and Analog FastSPICE (AFS) custom and analogue/mixed-signal (AMS) circuit verification platform are now qualified for Samsung Foundry’s newest process technologies. Customers can now use these offerings on Samsung’s 5/4-nanometer FinFET processes for the verification and sign-off of production tapeouts for their most advanced IC designs.

22nd July 2020
Analog FastSPICE eXTreme boosts verification performance

Mentor has announced significant advances in the Analog FastSPICE Platform with the introduction of Analog FastSPICE eXTreme technology for nanometer-scale verification of large, post-layout analog designs.

20th July 2020
Calibre nmLVS-Recon to streamline IC circuit verification

To help integrated circuit (IC) designers achieve design closure faster, Mentor, has announced the extension of their Calibre Recon technology to the Calibre nmLVS circuit verification platform.

14th July 2020
Mentor and Samsung streamline in-fab memory testing

Mentor, a Siemens business, has announced it has collaborated with Samsung Foundry to develop a new reference kit designed to help mutual customers substantially simplify and streamline the testing, diagnosis and repair of in-fab memory in advanced systems-on-chip (SoCs) during fabrication.

Artificial Intelligence
19th June 2020
Tessent safety ecosystem helps AI vision processor

Mentor has announced that its Tessent Safety ecosystem helped artificial intelligence (AI) vision silicon company Ambarella successfully meet in-system test requirements and achieve ISO26262 automotive safety integrity level (ASIL) goals for its CV22FS and CV2FS automotive camera system-on-chips (SoCs).

11th March 2020
UMC certifies Mentor product lines

Mentor, a Siemens business, has announced that multiple Mentor product lines are now certified for United Microelectronic Corporation’s (UMC’s) 22uLP (ultra Low Power) process technology, including Mentor’s Calibre platform, Analog FastSPICE platform, and Nitro-SoC digital design platform.

Artificial Intelligence
13th February 2020
Adoption of platforms for AI processor design

Mentor, a Siemens business, has announced that Mythic, an artificial intelligence (AI) processor company, has standardised on Mentor’s Analog FastSPICE Platform for AI processor design, custom circuit verification and device noise analysis. Additionally, Mythic has selected Mentor’s Symphony Mixed-Signal Platform to help verify the functionality of the integrated analog and digital logic in its Intelligence Processing Units (IPUs...

7th January 2020
CES 2020: Siemens, ARM unveil automotive design partnership

Siemens Digital Industries Software and ARM announced a partnership formed to help automotive manufacturers design their own silicon at the Consumer Electronics Show in Las Vegas. David Fritz, Global Automotive IC Technology Manager, Mentor asserts that it is inevitable that car makers will want to design custom silicon from the outset of a car’s design.

19th December 2019
Embedded firewall to protect automotive systems

By 2022, more than two-thirds of new cars on US roads will have online connections to their safety-critical system, putting them at risk of deadly hacks (Consumer Watchdog report, July 2019) to vehicles’ ‘head’ systems, used primarily for infotainment, GPS navigation, and other features.

16th December 2019
Solutions for cloud AI chip targeting neural network training

Mentor, a Siemens business, has announced that artificial intelligence (AI) solution provider Enflame Technology has recently used Mentor’s Tessent software product family to successfully meet silicon test requirements and achieve rapid test bring-up for its new Deep Thinking Unit (DTU) chip.

10th December 2019
Analogue mixed-signal tools for analog IC designs

Mentor has announced that its Tanner analog/mixed-signal (AMS) design tools – the Tanner S-Edit schematic capture tool and the Tanner L-Edit layout editor – are now certified for TSMC’s interoperable PDKs (iPDKs) for a broad range of TSMC specialty process technologies for high-volume analog IC designs.

10th December 2019
Connect automation reduces IC test implementation costs

Mentor has introduced Tessent Connect – an innovative design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods.

12th November 2019
Ecosystem meets autonomous vehicles test needs

Mentor has introduced the Tessent software Safety ecosystem – a comprehensive portfolio of automotive IC test solutions with links to its industry-leading partners. The program helps IC design teams meet the increasingly stringent functional safety requirements of the global automotive industry.

Test & Measurement
10th November 2019
Design-for-test platform cuts IC implementation costs

There were two slides in Geir Eide’s PowerPoint presentation about Mentor Graphics newly introduced Tessent Connect design for test (DfT) platform that resembled a before and after advertisement. In the first slide IC design teams are using conventional design for test methodology which induces headaches as they try to retrofit flows to use hierarchical components and technologies.

Aerospace & Defence
6th June 2019
De-risking electrical compliance in the aerospace industry

  Tony Nicoli, Aerospace & Defence Director, Mentor’s Integrated Electrical Systems Division, speaks to Electronic Specifier about the company’s new automated design-for-compliance methodology that will impact the aerospace industry.

25th April 2019
Innovative TSMC-SoIC 3D chip stacking technology

It has been announced by Mentor, a Siemens business, that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified on TSMC’s 5nm FinFET process technology. Mentor also announced it has successfully completed reference flow materials in support of TSMC’s innovative System-on-Integrated-Chips (TSMC-SoIC) multi-chip 3D stacking technology.

24th April 2019
Solution to enhance power efficiency of MCU designs

Continuing to expand its functional verification footprint across high-growth markets and applications, Mentor, a Siemens business, has announced that Arm China has selected Mentor’s Questa Simulation with Power Aware verification solution to handle critical tasks in the development of next-generation, low-power microcontroller (MCU) cores.

1st April 2019
PCB design platform for global design and data management

It has been announced by Mentor, a Siemens business, that DAIKIN has selected Mentor’s Xpedition printed circuit board (PCB) design flow software as their global design environment. Although DAIKIN had an established PCB design process, the company needed to share CAD library and design data across its globally dispersed locations in order to increase design efficiency and quality.

Artificial Intelligence
7th February 2019
Solutions to speed time to market for AI acceleration chip

It has been announced by Mentor, a Siemens business, that artificial intelligence (AI) semiconductor innovator Graphcore successfully met its silicon test requirements and achieved rapid test bring-up on its Colossus Intelligence Processing Unit (IPU) by using Mentor’s Tessent product family.

Events News
6th February 2019
Heterogeneous SoCs to deliver secure systems at embedded world

Make optimal use of the latest multi-core and heterogeneous SoCs to deliver reliable safe and secure systems that incorporate rich graphics and connectivity with a customisable Mentor Embedded Linux solution, the low power capable Nucleus RTOS, and a high performance Type 1 Hypervisor, at embedded world 2019.

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