KIOXIA announced that it has begun sampling the latest generation of its Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices. 

KIOXIA Europe announced that it is participating at this year’s Mobile World Congress in Barcelona from 26-29 February 2024. 

KIOXIA announced sampling of the industry’s first Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devicesdesigned for automotive applications.

KIOXIA SSDs took flight with the launch of the NG-20 mission rocket, which is delivering an updated HPE Spaceborne Computer-2, based on HPE EdgeLine and ProLiant servers from Hewlett Packard Enterprise (HPE), to the International Space Station (ISS).

KIOXIA has announced a sampling of new, high performing JEDEC e-MMC Ver. 5.1 compliant embedded flash memory products for consumer applications.

KIOXIA has announced sampling of new, higher performing UFS (Universal Flash Storage) Ver. 4.0 embedded flash memory devices. 

KIOXIA shares the recent developments in cooperation between, KIOXIA Corporation and Western Digital Corp. The companies announced details of their newest 3D flash memory technology. 

KIOXIA Europe GmbH announced that KIOXIA Group is increasing the usage of renewable energy by installing large-scale solar power generation systems for the first time at its Kitakami Plant and Yokkaichi Plant.

The HPE Spaceborne Computer-2, the first in-space commercial edge computing and AI-enabled system to run on the International Space Station, is part of a greater mission to significantly advance computing and reduce dependency on communications as space exploration continues to expand. For example, astronauts can achieve increased autonomy by processing data directly on the ISS, eliminating the need to send raw data to Earth to be processed, anal...

KIOXIA Europe GmbH announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications.

KIOXIA Europe is sampling new industrial-grade flash memory devices. This new lineup utilises KIOXIA’s latest generation BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package.

At embedded world 2022, Electronic Specifier's Editor, Mick Elliott, speaks with Axel Stoermann, Vice President of Embedded Products at KIOXIA Europe about the products they are exhibiting at the show.

At embedded world 2022, KIOXIA Europe announced sampling of the XFM Ver.1.0-compliant removable PCIe attached, NVMe storage device in capacities of 256GB and 512GB: the XFMEXPRESS XT2.

KIOXIA Europe GmbH (formerly Toshiba Memory Europe GmbH) will present its product line-up of high-end embedded flash memory solutions for automotive, consumer, industrial and telecom infrastructure applications.

KIOXIA Europe GmbH has announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new line-up utilises the company’s BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences.

KIOXIA EDSFF E1.S SSDs now available for hyperscale data centers

KIOXIA Europe has announced KIOXIA Corporation’s plans for a 20 billion yen investment to expand its Technology Development Building at its Yokohama Technology Campus and to establish its new Shin-Koyasu Advanced Research Center.

KIOXIA Europe has confirmed the appointment of Asayuki Nannichi as its new president. He replaces the previous president Masaru Takeuchi. Mr Nannichi has thirty years industry experience, occupying high level sales and marketing roles in Japan, North America and EMEA. Under his leadership, KIOXIA Europe will now prepare itself to address the numerous challenges and opportunities that are currently emerging within the European data storage ma...

KIOXIA Europe has announced sampling of its 1 terabyte (TB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in a 1.1mm-high package, the new product utilises KIOXIA’s BiCS FLASH 3D flash memory and achieves sequential read speed of up to 2,050MB/sec and sequential write speed of up to 1,200MB/sec.

KIOXIA Corporation held a ceremony for its semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. According to the company, the facility will be one of the most advanced manufacturing operations in the world, dedicated to the production of its proprietary 3D flash memory BiCS FLASH. The first phase of construction is scheduled to be completed by the spring of 2022.