HV-ModAL, a German research project to improve the power of EV drive trains, aims to create an electric drive train modular system toolbox which is suitable for a wide range of EVs, within three years. Thus, the ten partners from the whole automotive value chain and the sciences intend to further expand the global market position of the German automotive industry in the field of EVs – pure electric, PHEVs and small transport vehic...

Infineon Technologies has announced the introduction of a family of rugged, reliable 700V High-Voltage ICs (HVICs) optimised for solar, power supply, uninterruptible power supplies (UPS), welding and industrial drive applications. The 700V offering enables designers of high-voltage power stages to simplify their design while making them more robust.

A 6.5kV power module that features IGBT and freewheeling diode functionality integrated into a single chip has been introduced by Infineon Technologies. This RCDC chip is suitable for modern high-speed trains and high-performance locomotives as well as for future HVDC electric power transmission systems and medium voltage drives used for example in oil, gas and mining industries.

The European Commission is launching three new research projects aimed at making electromobility cheaper, more efficient and more reliable in order to facilitate more environmentally-friendly vehicles on Europe's roads. Europe will be the site for the continued development and production of EVs under these projects, which will run until 2018 and are headed by Infineon Technologies. 

Setting a new standard in the Power MOSFET market, Infineon Technologies has extended its medium voltage MOSFET portfolio with OptiMOS 300V. The device helps system designers to increase power density and reduce cost with the highest level of reliability. Ultimately, for the end user, this translates into energy cost savings.

Infineon Technologies has announced that it is working with Google’s Advanced Technology and Projects group (ATAP) to develop a sensing solution. Potential applications include wearables, IoT and automotive applications.

An optically triggered thyristor that can improve the reliability, lower the system cost and simplify the design of ultra-high-power applications has been introduced by Infineon Technologies. The 6” thyristor incorporates reliable optical triggering, eliminating the requirement for an external electrical trigger circuit. In addition, on-board safety features such as overvoltage protection, dv/dt protection and protection against forward vol...

  Infineon Technologies has launched a new family of CoolMOS C7 series superjunction MOSFETs. The 600V series offers a 50% reduction in turn-off losses compared to the CoolMOS CP, offering a GaN-like level of performance in PFC, TTF and other hard-switching topologies.

Infineon Technologies is the first company in the world to manufacture automotive power MOSFETs on 300mm thin wafers. The OptiMOS 5 family of power semiconductors, optimised for CO2 reduction applications, is the first group of products to be released on the thin-wafer technology.

At this year's PCIM 2015 trade show Infineon Technologies will launch a new Intelligent Power Module (IPM). The MIPAQ Pro provides an all-in-one solution for a wide spectrum of scalable and compact inverter designs to be implemented in wind, solar and industrial drives applications. The MIPAQ Pro is a fully qualified and tested IPM, integrating IGBTs, gate drivers, the heat sink, sensors, digital control electronics as well as digital bus communi...

At PCIM 2015, Infineon Technologies will present the latest generation of its PrimePACK power modules, which benefit from the new generation of Infineon’s IGBTs. The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies.

Featuring highly accurate 3D sensing with extremely low power consumption, the TLV493D-A1B6 3D magnetic sensor has been introduced by Infineon Technologies. Magnetic field detection in x, y and z axes allows the sensor to reliably measure 3D linear and rotation movements, while the implemented digital I²C interface enables fast and bidirectional communication between sensor and MCU.

PCIM 2015 will pay host, for the first time in Europe, to the combined power portfolio of Infineon and International Rectifier, in hall 9, booth 412, from 19th to 21st May 2015. The result of Infineon's strategic approach, outlined as “from product thinking to system understanding,” the company's range of products includes MOSFETs, IGBTs, GaN devices and speciality materials.

It has been announced that Infineon Technologies has purchased all outstanding shares of LS Power Semitech. The strategic acquisition increases Infineon’s global footprint in the growing market segment of Intelligent Power Modules (IPM) which enable higher energy efficiency in consumer appliances such as refrigerators, freezers, washing machines, dryers and air conditioners.

  The first packages for power semiconductors were very large, difficult to process and a challenge to cool well. Infineon has created the TO-Leadless power package for high-current applications. Ralf Walter, Infineon Technologies explains.

Infineon has announced that its OPTIGA TPM (Trusted Platform Module) with SPI (Serial Peripheral Interface) has achieved Common Criteria Certification EAL4+, enabling system manufacturers to distinguish and select trustworthy solutions based on internationally recognised, independent testing. The certificate was presented by the Federal Office for Information Security (known as BSI) at the RSA conference in San Francisco.

Supporting the trend from relay to more robust semiconductor solutions, Infineon Technologies has released its HITFET+ family of protected low-side switches. The HITFET+ family offers a compelling feature-set with its diagnosis function, digital status feedback and short-circuit robustness, and controlled slew rate adjustment for easily balancing switching losses and EMC compliance. 

Microelectronics is the key enabling technology for Industry 4.0, the networked production of the future. At the Hannover Messe, Infineon Technologies demonstrates how it supports a secure Industry 4.0.

Infineon has utilised the Hanover Messe to announce its XMC4800 series of 32-bit MCUs with on-chip EtherCAT (Ethernet for Control Automation Technology) node. With its real-time capability, the XMC4800 series will drive networked industrial automation and Industry 4.0 applications. AEC Q100 qualified, the MCUs are suited for applications in commercial, construction and agricultural vehicles.

Infineon Technologies has announced the expansion of its Gallium Nitride (GaN)-on-Silicon technology and product portfolio. The company now offers both enhancement mode and cascode configuration GaN-based platforms optimised for high performance applications requiring superior levels of energy efficiency including Switch Mode Power Supplies (SMPS) used in servers and telecomms, and consumer goods such as Class D Audio systems. GaN technology sign...