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Infineon Technologies AG

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

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Enclosures
7th June 2017
High power density discrete IGBT in TO-247PLUS package

Infineon Technologies has expanded its 1200 V discrete IGBT product portfolio by offering up to 75 A. The devices are co-packed with a full rated diode in a TO-247PLUS package. The new TO-247PLUS 3pin and 4pin packages serve the growing demand for higher power density and highest efficiency in discrete packages. Typical applications with a blocking voltage of 1200 V requiring high power density are drives, photovoltaic, and UPS. Additional applic...

Analysis
5th June 2017
Infineon demonstrates first post-quantum cryptography on contactless security chip

Due to their computing power, quantum computers have the disruptive potential to break various currently used encryption algorithms. Infineon Technologies is ready to provide a smooth transition from today’s security protocols to next-generation post-quantum cryptography (PQC). The company has now successfully demonstrated the first PQC implementation on a commercially available contactless security chip, as used for electronic ID documents...

Analysis
5th June 2017
"eRamp" strengthens Germany and Europe in power electronics

One of the most important European research projects for energy efficiency, “eRamp”, is coming to a close. Over the past three years, 26 partners from business and science have explored innovative electronics components for using energy even more efficiently. Their focus was on the rapid introduction of new production technologies, such as packaging technologies for energy-saving chips. The eRamp project covered the entire power elect...

Power
24th May 2017
Full-SiC-module suits PV inverters, UPS & charging systems

Higher efficiency, increased power density, smaller footprints and reduced system costs: these are the main advantages of transistors based on SiC. Infineon Technologies is starting volume production for the Easy 1B, the first full-SiC module announced during PCIM 2016. At PCIM 2017, the company showcased additional module platforms and topologies for the 1200V CoolSiC MOSFET family. Infineon is now able to bring the potential of SiC technology t...

Communications
23rd May 2017
Contactless technologies on the rise in smart cities

Contactless card and touch-and-go mobile technology payments are on the rise: especially consumers and commuters in highly populated urban areas require higher transaction speeds and more convenience. Infineon helps card and device manufacturers and transport operators to cope with the security and performance challenges of this trend.

Analysis
23rd May 2017
Productive4.0: Microelectronics for connected production

“Productive4.0”, the largest European research initiative to date in the field of Industry 4.0, has been launched at Infineon Technologies in Dresden. Coordinated by Infineon, more than 100 partners from 19 European countries will work on digitising and networking industry. Involved in the project are partners such as BMW, Bosch, Philips, Thales, NXP, STM, SAP, ABB, Volvo and Ericsson, and leading institutes such as the Karlsruhe Inst...

Power
22nd May 2017
IPM combines boost PFC stage & 3 phase inverter

Infineon has introduced the CIPOS Mini, featuring power factor correction (PFC). The intelligent power module (IPM) combines a single switch boost PFC stage and a 3 phase inverter in one package. With the PFC integrated into the inverter module, the integrated CIPOS Mini IPM helps to reduce system size and the bill of material. Moreover, the additional PCB space gives room for further components.

Analysis
12th May 2017
Infineon ranked in top ten semiconductor suppliers

Later this month, IC Insights will release its May Update to the 2017 McClean Report. This update includes a discussion of the 1Q17 semiconductor industry market results, an update of the capital spending forecast by company, a review of the IC market by electronic system type, and a look at the top 25 1Q17 semiconductor suppliers (the top ten 1Q17 semiconductor suppliers are covered in this research bulletin). 

Analysis
28th April 2017
Infineon wins Toyota's ‘Best Quality Award’

The car manufacturer Toyota has awarded Infineon Technologies with its ‘Best Quality Award’. The ‘Best Quality Award’ is presented to suppliers for achieving zero defects for three years running. Infineon was acknowledged for delivering CAN transceivers of outstanding quality.

Power
20th April 2017
40V MOSFET suits battery powered applications

Infineon complements its StrongIRFET family with a 40V MOSFET packaged in D²PAK 7pin+. The new MOSFET family offers an extremely low R DS(on) of 0.65mΩ and the highest current carrying capability in the industry. This increases both robustness and reliability for high power density applications which require high efficiency and reliability. The surface mount D²PAK 7pin+ package targets low voltage drives, battery po...

Communications
12th April 2017
The 5G Automotive Association (5GAA) gets its latest member

The communication infrastructure and stable mobile connectivity is going to be vital to the future of automated cars. Therefore, the introduction of 5G is going to be key. With this in mind Infineon Technologies, a contributor to the introduction of the 5G standard into the car, has recently announced that it has joined the 5G Automotive Association (5GAA). The association works on the introduction of new communication solutions enabling con...

Power
12th April 2017
Quasi-resonant flyback controller offers faster startup

The 5th gen of Infineon Technologies' stand alone quasi-resonant flyback controller and integrated power IC CoolSET family has been introduced. The latest development in this family of devices offers improved efficiency, faster startup, and better overall performance under varying load conditions. The new ICs are especially designed for AC/DC switch mode power supplies in a great variety of applications such as aux power for home appliances,...

Power
6th April 2017
Efficient MOSFETs operate at 600V breakdown voltage

Infineon Technologies has extended its existing portfolio of CoolMOS technologies with the 600 V CoolMOS P7 and 600 V CoolMOS C7 Gold (G7) series. The product families are designed to operate at 600V breakdown voltage and deliver improved superjunction MOSFET performance. They achieve unmatched power density in their respective target applications.

Power
6th April 2017
MOSFETs’ small package increases density and saves space

There are three voltage classes in the new logic level IR MOSFET family. They are offered in a PQFN package, designed to deliver high power density and improve efficiency, says Infineon Technologies.

Optoelectronics
28th March 2017
On the road to smart: lighting intelligence for everyone

Lighting is a huge consumer of global energy, contributing to around 20% of all the electricity consumed globally. Approximately 80% of that lighting is attributed to professional applications such as building, office, industry or street lighting, and about 20% to private residential lighting. 

Design
20th March 2017
Development kits cut EtherCAT design time

Infineon Technologies says that it is making the cost-efficient implementation of EtherCAT applications gets even easier – with it’s future- proof and application-optimised ARM-based microcontrollers. The company has released new development kits that help cutting down EtherCAT development time to three months: the XMC4300 Relax EtherCAT Kit and the XMC4800 EtherCAT Automation Kit. Both kits passed the EtherCAT certification test and ...

Power
13th March 2017
Modules in 62 mm package enable higher power density

Infineon Technologies has expanded its offering of 62 mm IGBT modules. The new power modules serve the growing demand for higher power density without increasing package size. This is realised by a larger chip area and an adapted DCB substrate in the proven 62 mm package. Typical applications for modules with 1200 V blocking voltage are drives, solar inverters and uninterruptible power supply (UPS) as well as medium voltage drives for modules wit...

Analysis
1st March 2017
MEMS microphones provide unmatched voice-recognition

Infineon Technologies and XMOS partner to deliver a new building block for voice recognition. It features a combination of radar and silicon microphone sensors from Infineon and audio processor from XMOS. The devices provide far field voice capture by audio beamforming combined with radar target presence detection. Together, they guarantee for optimal sound recognition and flawless execution for digital voice assistance across a broad range of vo...

Power
28th February 2017
MOSFET regulator reduces component count

An easy-to-use, fully integrated and highly efficient DC/DC regulator has been introduced by Infineon Technologies. The IR3883 aims at high density Point of Load applications where high efficiency, high reliability and good thermal behaviour are required. The device is suitable for NetCom, telecom, servers and storage solutions.

Analysis
28th February 2017
Mobile ID turns smartphone into connected ID card

Notify the council of your new address, pick up your rental car, car share, or vote by smartphone app? Increasing connectivity enables a wide range of new and useful online services to be accessed anytime from anywhere. The success of these services, however, depends on secured digital identities and authentication processes for mobile devices. These solutions supplement proven electronic identification (eID) documents and offer users faster and ...

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