Heraeus Electronics GmbH
Heraeus Electronics GmbH Articles
Copper core aluminium wire targets power applications
A next generation wire for power applications has been released by Heraeus Electronics.
Heraeus gains IATF certification for quality management
Heraeus Electronics has received the 16949 certification of the International Automotive Task Force (IATF) for its site in West Conshohocken, Pennsylvania. The accredited verification ensures that the requirements for international quality systems for the automotive industry are fulfilled at any time.
EMI shielding technology boosts 5G performance
Electromagnetic interference (EMI) is increasingly becoming a challenge– especially for new generation mobile phones and 5G technology. Heraeus now offers a new complete solution consisting of silver ink, inkjet printer and curing equipment for EMI shielding. This system is reportedly less expensive and more effective than all other options available.
Combining expertise for stretchable electronics technology
The technology start-up company Forciot has announced that Heraeus Holding and Volvo Cars’ Technology fund have made investments in the company as part of the Forciot’s Series A investment round. Forciot’s product is a stretchable electronics and algorithm solution that measures and reports accurately force, weight, balance and pressure and the system can also be utilised as HMI touch controller.
Achieving miniaturisation success
As LEDs continue to shrink in size, there is a need for materials that dissipate heat quickly and solutions to ensure the effective electrical connection of micro LEDs. At the International LED professional Symposium 2018, Heraeus shows how this can be achieved.
Increasing efficiency of heating for semiconductor production
At the SEMICON Taiwan exhibition in Taipei at the beginning of September, Heraeus Noblelight will present black.infrared, a global first for the semiconductor and photovoltaics industry. The innovative infrared system functions according to a completely new emitter principle.
New Die Top System with power cycling capacity introduced
A new system for chip-top contacting in power electronics modules will be presented by Heraeus Electronics at the PCIM Asia conference in Shanghai from 26th to 28th June, 2018. The Die Top System boosts the chip’s current carrying capacity by more than 50% and offers greater reliability, which allows manufacturers of electric and hybrid cars to test the limits of power transmission in simulation tests.