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Future Electronics

Future Electronics Articles

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Analysis
22nd February 2017
Future Electronics bolsters NFC offering

Future Electronics has signed worldwide distribution agreements with Smartrac and Elatec which enable it to supply customers with a comprehensive choice of NFC, HF and UHF tag ICs and inlays, reader ICs and reader modules. Smartrac is a manufacturer of NFC, HF and UHF inlays. Inlays are tag labels which may be applied to almost any end product or package for data-rich, wireless identification. Germany-based Elatec supplies integrated, certified N...

Events News
15th February 2017
Tech Talks cover wide range of topics at Embedded World

A programme of ‘Tech Talks’ presentations by leading semiconductor manufacturers will be hosted on the Future Electronics stand at Embedded World in Nuremberg , (March 14-16, 2017). The presentations will shed light on some of the most pressing issues facing embedded system developers today, including security, connectivity and the Internet of Things.

Analysis
17th January 2017
Smart street light solution arrives in EMEA

Future Electronics has strengthened its position in the lighting sector by signing a distribution agreement covering EMEA with Flashnet, a provider of Internet of Things (IoT) infrastructure and smart city solutions. The agreement sees Future distributing Flashnet’s inteliLIGHT, a LoRaWAN-compatible smart street lighting solution. It is effective immediately.

Events News
16th December 2016
Free industry 4.0 seminar set for February in Minden

OEM design engineers and engineering managers are being invited by Future Electronics to attend an ‘Industry 4.0’ seminar on February 22 2017 in Minden, North Rhine-Westphalia, Germany. The all-day seminar is intended for engineering professionals at companies working in the field of industrial and factory automation. It is also open to final-year engineering students.

Events News
16th December 2016
IoT solution lined up for Embedded World

A true “sensor to cloud” solution allowing users to more easily evaluate their product in the IoT world will be presented by Future Electronics at Embedded World in Nuremberg (March 14-16 2017). The Future Electronics IoT Solution Platform provides cloud storage, security and dashboard analytics designed to be an out of the box solution for fast and easy evaluation allowing embedded developers to tailor the cloud service to the specif...

Events News
18th September 2016
Industry 4.0 demoes lined up for electronica 2016

Demonstrations of the latest security, cloud connectivity and power technologies for Industry 4.0 will be showcased by Future Electronics at electronica in Munich (November 8-11). The distributor’s stand will feature pods showing technologies grouped into three themes: Experience Security, Experience Power and Experience the Cloud.

Events News
11th April 2016
Europe wide seminars focus on IoT security

A series of ‘Secure Wireless Sensor Node’ seminars across Europe in May and June is being organised by Future Electronics in conjunction with World IoT day. With the explosion in IoT edge nodes, from feeding information about the health of a patient to the health of a pot plant; the data collected and analysed can reveal valuable insights that allow for more pro-active and streamlined decisions and activities.

Analysis
5th May 2015
Distribution pact covers 'breakthrough' technology

Future Electronics has signed a global distribution agreement with semiconductor start-up Ambiq Micro. Founded in 2010, Ambiq Micro has developed breakthrough technology based on a patented Subthreshold Power Optimised Technology (SPOT) platform that reduces the amount of power consumed by semiconductors.

Sensors
9th April 2015
Gas sensors get global distribution platform

Cambridge CMOS Sensors has stepped onto a global distribution platform. It has signed a franchise agreement with Future Electronics that makes CCS’s compact, low-power gas sensors available to the mass market of industrial and consumer electronics OEMs served by Future Electronics globally.

Events News
15th January 2015
Free Bluetooth Low Energy Workshops tour Europe

Future Electronics will stage a series of Bluetooth Low Energy (BLE) technical workshops run jointly with Cypress Semiconductor in February, March and April at various European venues. At the workshops, design engineers will have the opportunity to implement a sensor system with BLE connectivity based on Cypress’s PSoC 4 BLE programmable system-on-chip.

Events News
24th September 2014
Live Internet of Things demo set for electronica

An Internet of Things demonstration will be the centrepiece of Future Electronics presence at electronica in Munich (Nov 11-14) The distributor has teamed up with Semtech and Microchip Technology, to deploy an ISM-band IoT network using LoRa technology, providing wireless connectivity across most of the Munich area with only a few gateways (base stations) during electronica week.

Boards/Backplanes
3rd June 2014
Evaluation kit aids touch sensitive designs

Future Electronics has added to the development boards on its FTM Board Club website. The latest offering is the capacitive sensing evaluation kit from Cypress Semiconductor now available free to design engineers.The CY3280-MBR3 CapSense MBR3 Evaluation Kit helps designers to evaluate the third generation of Cypress Semiconductor’s capacitive-sensing technology. It can be used to develop CapSense button designs, and to implement proximity s...

Boards/Backplanes
18th March 2014
Design engineers get free Nucleo board offer

Future Electronics is making the new range of STM32 Nucleo prototyping boards from STMicroelectronics available free via its FTM Board Club website for design engineers. The Nucleo boards are compatible with ARM’s mbed application development platform. They also include ST Morpho extension headers to allow access to all of the microcontroller’s on-chip peripherals, and Arduino headers which accept shields from the extensive Arduino ec...

Design
27th November 2013
Choosing the right Road TO Success

Selecting a Real-Time Operating System (RTOS) begins with an appreciation of its benefits, fundamental features and basic taxonomy; the cost incurred even when selecting a no-cost option. Daniel Stegeran, Technical Solutions Manager for Future Electronics (Romania), discusses in detail in this article from ES Design magazine.

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