Companies

Filtronic

  • Filtronic House 3 Airport West Lancaster Way Yeadon Leeds West Yorkshire
    LS19 7ZA
    United Kingdom
  • +44 113 220 0000
  • http://www.filtronic.com

Filtronic Articles

Displaying 1 - 8 of 8
Events News
28th September 2022
E-band transceiver targets 5G XHaul applications

Filtronic launched Morpheus X2, the latest generation of its market-leading E-band transceiver for carrier-grade applications in 5G backhaul, midhaul and fronthaul – collectively known as XHaul at European Microwave Week in Milan (September 27-28).

News & Analysis
27th July 2022
North east firms collaborate in advanced materials group

The North East Advanced Materials Electronics (NEAME) cluster group has been launched today (July 27).

News & Analysis
7th April 2022
Israeli deal extends Filtronic’s reach

Filtronic has signed a sales representative agreement with Israel-based Ormic Components.

Frequency
6th April 2022
Extended E-band amplifiers range unveiled at EuMW

Filtronic announced the availability of the extended Cerus range of high-power E-band amplifiers at European Microwave Week (EuMW) in London.

News & Analysis
16th August 2021
Tower Top Amplifier tops expectations for Tier 1 US OEM

Filtronic says it has successfully developed a customised Tower Top Amplifier (TTA) system for a public safety OEM in the USA.

Communications
7th May 2020
Tower Top Amplifier system comes with smart redundancy

A range of Tower Top Amplifier (TTA) systems designed for use in two-way radio networks, particularly for public safety systems such as P25 has been announced by Filtronic.  

News & Analysis
7th February 2020
Filtronic clinches advanced mmWave contracts

Filtronic has won contracts for two separate advanced mmWave design and developments that have strategic importance for the Company and its technology roadmap.

Analysis
2nd December 2019
Filtronic spends $1.5m to meet E-band module demand

Filtronic has invested over $1.3 million in new equipment for its manufacturing facility to meet a growing demand for both its highly-integrated E-band transceiver modules for mobile telecoms backhaul infrastructure and its precision hybrid microelectronics assembly and test services, including mmWave device packaging and sub-assembly manufacturing.

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