EBV Elektronik

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EBV Elektronik Articles

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22nd April 2022
Going Green? Protect with Broadcom Optocouplers

Join us in this webinar to understand how Broadcom optocouplers meet the challenges that arise from these new, demanding applications.   Going Green?  Live Webinar  Protect with Broadcom Optocouplers  May 04, 2022  3:00 pm CEST 

14th April 2022
EBV Elektronik presents power and analogue theme at PCIM

EBV Elektronik is planning to showcase an extensive range of analogue and power technologies at the PCIM exhibition in Nuremberg (May 10-12).

9th March 2022
EBV’s Analog & Power Podcast Series

The first of 6 exciting episodes is available now: This episode is all about these analog ICs. What do you need them for? What do they have to do with digitalization? The first episode Analog ICs: Connecting physical and digital worlds - will answer your questions. Listen also to our recent episodes on SiC & GaN, Wearables, EV Charging, UV LEDs, Edge Computing and Robotics.  

23rd February 2022
Going Green? Protect with Broadcom Optocouplers

Accelerate your green energy designs with isolation solutions from Broadcom! Broadcom optocouplers are used in an array of green applications ranging from solar and wind inverters, energy storage, automotive electric vehicles and charging and power supplies. Optocouplers provide both electrical insulation and signal isolation. Find your perfect fit! Learn how Broadcom can support you with your green energy applications.

News & Analysis
1st December 2021
MicroSys cooperates with EBV Elektronik in EMEA

 EBV’s customers set to benefit from MicroSys’ System-on-Modules product portfolio and services

22nd November 2021
EBV Elektronik announces support for Arm's Cassini Project

EBV Elektronik has announced its full support for Arm in its efforts to bring a cloud-native experience to the edge through Project Cassini, the company's high-profile cross-platform initiative.

20th October 2021
Bringing a cloud-native experience to the edge

EBV Elektronik, an Avnet company, has announced its full support for Arm in efforts to bring a cloud-native experience to the edge, via the company’s high-profile Project Cassini cross-platform initiative.

News & Analysis
15th June 2021
EBV, Infineon partner for CoolSiC initiative

EBV Elektronik, an Avnet company, has agreed to be the first distributor to run a programme dedicated to Infineon’s silicon carbide (SiC) based CoolSiC technology.

News & Analysis
22nd April 2021
Northforge deal helps Avnet, EBV support Broadcom

Avnet and EBV Elektronik, an Avnet company, have signed an agreement with Northforge Innovations, a software consulting and development company to promote Northforge to Broadcom customers in North America and EMEA.

5th March 2021
BridgeSwitch solution simplifies motor driver design

At the heart of the EBV BridgeSwitch MB solution from EBV Elektronik is an integrated half-bridge device from Power Integrations.

News & Analysis
3rd March 2021
EBV Elektronik inks EMEA deal with LPWAN specialist

The full array of wireless access network (LPWAN) modules from Neoway are now on sale at distributor EBV Elektronik.

24th February 2021
LPWAN module combines power efficiency and security

To support the proliferation of IoT development, EBV Elektronik has introduced the HERACLES 324M, a next generation low-power wide-area network (LPWAN) module.

News & Analysis
24th November 2020
Cypress Semiconductor bolsters EBV Elektronik linecard

Cypress Semiconductor has joined the EBV Elektronik linecard following its acquisition by Infineon.

19th November 2020
Delivering sensing solutions to European engineers

EBV Elektronik has signed a distribution agreement with ACEINNA to offer ACEINNA’s complete range of MEMS based sensing solutions and technologies to its customers.

News & Analysis
11th November 2020
EBV steps up to aid Made in Space Europe program

EBV Elektronik has emphasised its support for ongoing space endeavour by announcing a major collaboration with Made In Space Europe.

26th March 2020
Analysis optimistic for fast-industry rebound post-COVID-19

The coronavirus will place a massive burden on the global economy. All industrialised countries are likely to fall into recession in the first half of 2020. However, a recovery is expected in the second half of the year if the epidemic dies down by mid-year.

18th December 2019
MPU-based solution gives lift off to TSN Ethernet

TSN applications to support multiple real-time industrial Ethernet protocols have been developed by a team of EBV Elektronik, NXP Semiconductors and Fraunhofer IOSB-INA. The TSN demonstrator is based on NXP’s Layerscape LS1028A industrial applications processor, which is deployed in multiple LS1028ARDB reference design boards for the demonstrator.  

15th November 2016
WiFi Cloud-On-Chip is complete 802.11 b/g/n networking solution

IRIS ,the latest EBVchip device is a complete 802.11 b/g/n networking solution on a chip. It was developed by EBV Elektronik and DeviceDrive, a Cloud-on-Chip innovator based in Oslo. The device targets various applications like smart power plugs, home automation, mesh network gateway, industrial wireless control, sensor networks, wearable electronics, WiFi location-aware devices, security ID tags and WiFi position system beacons. 

8th March 2015
RF module speeds time to market for meter makers

A team formed of EBV Elektronik, WEPTECH elektronik and STMicroelectronics have developed a flexible sub-GHz RF module that streamlines certification of wireless M-BUS and OMS metering systems. The module, called MAIA within the EBVchips program, addresses different metering applications, including automatic meter reading (AMR), advanced metering infrastructure (AMI), gas and water meters, and electricity meters, as well as heat meters or readers...

27th February 2015
Low power wireless MCU platform supports multiple standards

An ultra-low-power wireless microcontroller platform that helps customers go battery-less with energy harvesting or enjoy always-on, coin cell-powered operation for multiple years has been announced by EBV Elektronik. It gives users the flexibility to develop products that support multiple wireless connectivity standards using a single-chip and identical RF design.  

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