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Diamond Systems Corp.

Diamond Systems Corp. Articles

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Communications
4th May 2011
Expansion Modules Address SBC Form Factor Fragmentation

Diamond Systems Corporation, a leading global supplier of compact, rugged, embedded computing solutions for real-world applications in a broad range of markets, today unveiled a new family of I/O expansion modules for systems based on single-board computers (SBCs) that expand using either PCI/104-Express, PC/104-Plus, or SUMIT-ISM.

Communications
4th May 2011
Managed 8-port Gigabit Ethernet Switch Matches PC/104 Footprint

Diamond Systems Corporation, a leading global supplier of compact, rugged, embedded computing solutions for real-world applications in a broad range of markets, today unveiled Epsilon, a managed Layer 2 managed Ethernet switch module offering eight 10/100/1000Mbps copper twisted pair ports on a PC/104 form-factor board. Epsilon can be used standalone, without any connection to a single board computer, or in conjunction with a host CPU.

Design
17th March 2011
SUMIT-ISM™ I/O Module Provides WiFi, Ethernet, USB, and SSD Expansion

Diamond Systems Corporation today unveiled Corona, the first multi-function SUMIT-ISM I/O module to combine WiFi, dual Ethernet, USB, and solid-state disk (SSD) expansion capabilities.

Design
17th March 2011
Rugged SODIMM Standard Beefs up Embedded Board Designs

Apacer Technology Inc., Accelerated Memory Production, Inc. and Diamond Systems Corporation today unveiled RSODIMMTM, a specification for rugged SODIMM memory.

Communications
12th October 2010
Conduction Cooling Augments Legacy PC/104 Market

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and expansion modules for real-world applications, launched today at the Intel Developer Forum (IDF) the Aurora single board computer (SBC) as a much-needed technological breakthrough in small form factor (SFF) embedded computing. Featuring the 1.6GHz AtomTM Z530 processor from Intel, Aurora combines US-based rugged design know-how with advanced manufacturing pr...

Communications
15th September 2010
Conduction Cooling Augments Legacy PC/104 Market

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and expansion modules for real-world applications, launched today at the Intel Developer Forum (IDF) the Aurora single board computer (SBC) as a much-needed technological breakthrough in small form factor (SFF) embedded computing. Featuring the 1.6GHz AtomTM Z530 processor from Intel, Aurora combines US-based rugged design know-how with advanced manufacturing pr...

Analysis
2nd March 2010
Diamond Mints “World’s First” FeaturePak DAQ Module

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today unveiled the world’s first data acquisition I/O module compatible with the newly-introduced FeaturePak embedded I/O expansion module standard. Despite its diminutive size (see actual size photo, below), the FP-DAQ1616 integrates Diamond’s newest and fastest analog I/O technology, and interfac...

Communications
2nd March 2010
Boardset Merges COM Express Cores with Triple-Play I/O

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today unveiled Magellan, a board-level “embedded-ready subsystem” (ERS) that combines the benefits of computer-on-modules (COMs) with those of stackable single-board computers (SBCs). This announcement means system manufacturers no longer need to design a custom carrier to deploy COM Express module...

Communications
2nd March 2010
COM Express Modules Take the Heat

Diamond Systems launched a family of COM Express 1.0 compliant computer-on-modules (COMs) based on Intel’s low-power, high-performance Atom and Core processors. Rated for operation over enhanced (-20o to +71o C) and extended (-40o to +85o C) temperature ranges, the modules are well suited to a broad range of fixed and mobile applications in the defense, avionics, transportation, energy management, and industrial automation sectors.

Analysis
2nd March 2010
Diamond Systems Joins Qseven Consortium

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today announced that it has become a Participating Member of the Qseven Consortium, a multi-vendor standards body dedicated to advancing the Qseven computer-on-module (COM) standard.

Communications
15th January 2010
Rugged SBCs Gain Windows Embedded SDKs

Diamond Systems Corp., a supplier of ruggedized single-board computers (SBCs), embedded-ready subsystems (ERSs), and I/O expansion modules targeting real-world applications, today launched a series of Windows Embedded Software Development Kits (SDKs) for its PC/104 and PC/104-Plus expandable Athena II, Hercules II, Helios, and Pegasus SBCs.

Communications
22nd December 2009
Diamond Spins Linux 2.6.23 SDKs

Diamond Systems Corp., a leading supplier of ruggedized single-board computer (SBC), embedded-ready subsystem (ERS), and I/O expansion modules targeting real-world applications, today launched a series of Linux Software Development Kits (SDKs). Each SDK includes a tiny solid-state IDE “flashdisk” module – preloaded with a Linux OS – that plugs directly into one of Diamond’s SBC or ERS products, ready to boot and run immediately. With al...

Communications
27th November 2009
Compact, Ruggedized, Fanless System Expands Flexibly

Diamond Systems has launched a series of compact, rugged, reliable, low-power systems aimed at high-reliability data acquisition and control applications. The Octavio-HLV and Octavio-ATHM embedded application servers are based on Diamond’s field-proven, PC/104-expandable Helios and Athena II single board computers, respectively. Thanks to Diamond’s unique 2-in-1 small form-factor SBCs, complete Octavio systems with built-in data acquisition s...

Communications
2nd October 2009
ETX-N270 - ETX 3.0 CPU Module Targets Harsh Environments

Diamond Systems Corp. today launched an ETX 3.0 compliant computer-on-module (COM) based on Intel’s low-power, high-performance Atom N270 processor. Rated for operation over an enhanced, -20o to +70o C temperature, the ETX-N270 is aimed at defense, transportation, energy management, industrial automation, and medical applications.

Communications
2nd October 2009
ETX-945 - Extended Temperature COM Boasts Core 2 Duo Performance

Diamond Systems Corp today launched a series of ETX 3.0 compliant computer-on-module (COM) products based on Intel’s LV and ULV CoreTM 2 Duo and Core Duo processors. The modules operate over an extended temperature range of -40o to +85o C, making them suitable for performance- and reliability-critical applications, including aerospace, defense, transportation, energy management, and industrial automation. To simplify the migration of PC/104-Plu...

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