DFI today launches the industrial grade EC300 series system, the latest addition to DFI’s embedded system family. Its passive cooling and anti-shock drive bay mounting is designed for factory floor environments. The unique modular-concept construction supports 12 system configurations using three riser cards and three I/O module options in a cable-free assembly.

DFI today launches 2 new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel Core processors. The supported processors are built on Intel’s 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors.

DFI today announces 2 new embedded boards in its product line based on the new Intel Q77 Express chipset. The 2 microATX form factor boards support the 3rd generation Intel Core processor family which is the next generation of 64-bit, multi-core processor built on 22-nanometer process technology.

DFI today launches a new COM Express Basic form factor module – CM901-B Type 6, powered by the AMD Embedded R-Series APUs. The supported processors are built on AMD’s 32-nanometer process technology and boast exceptional high graphics performance combined with enhanced energy efficiency.

DFI today announces a new compact design system, DS912-OT, offering low power consumption for digital signage applications. This embedded system is powered by the dual-core AMD T56N/T40N APU and AMD A50M Controller Hub. The low-profile heavy duty steel chassis accepts VESA, wall, or rack mounting using optional mounting kits.

DFI brings the latest Intel Xeon processor to the CL630-CRM ATX board. It is DFI’s first ATX board supporting the new Intel C216 Express chipset. This ATX board supports the Intel Xeon processor E3-1200v2 family built on 22-nanometer process technology and boasts a 15% CPU performance increase over the previous generation.

DFI today announced its wide temperature Qseven form factor module, QB701-B Series. The new module offers low power consumption, integrated memory, improved graphic processing support, I/O interface flexibility and wide temperature support from -20ºC to 70ºC making it suitable for various environments. This cutting-edge module pairs the Intel EG20T PCH with the low power Intel Atom processor E6x0T series.

DFI today launches a new Type 2 COM Express Compact form factor module, CD905 Series, offering the next generation Intel Atom processors. These low power module boards pair an Intel NM10 Express chipset with a range of Intel Atom processors, from the power efficient Intel Atom N2600 processor to the enhanced Intel Atom D2700 processor. These new dual-core processors are built on Intel's 32-nanometer process technology providing low power consumpt...

DFI today announces the SB336-Ni, the first microATX board that supports 10 Serial COM. This microATX form factor board pairs the cost-reduced Intel H61 Express Chipset with the 2nd generation Intel Core i7-2600, i5-2400, and i3-2120 processors that feature 32-nanometer process technology providing higher performance at lower power than previous processors. For cost sensitive applications, the embedded board also supports the economical Intel Pen...

DFI today launches the 3.5 Single Board Computer CD951 Series, offering the next generation Intel Atom processors. These SBC boards pair an Intel NM10 Express chipset with a range of Intel Atom processors, from the power efficient Intel Atom processor. These new dual core processors are built on Intel's 32-nanometer process technology providing low power consumption and yet higher clock frequencies and faster memory access than their predecessors...

DFI today launches a new compact design system, DS910-CD, offering low power consumption and fanless cooling for digital signage applications. This embeddedc system is powered by the 1.60GHz dual-core Intel Atom processor N2600 and Intel NM10 I/O Express chipset with 5W system TDP.

DFI has announced the SB630-CRM, the first ATX motherboard in its Intel Q67 product line. This ATX form factor board supports the 2nd generation Intel Core i7-2600, i5-2400, and i3-2120 processors that feature 32-nanometer process technology providing higher performance at lower power than previous processors.

DFI has announced the SB600-C, a new addition to its ATX embedded board line. This ATX form factor board utilizes the low-cost Intel B65 Express chipset and supports the 2nd generation Intel Core i7-2600, i5-2400, and i3-2120 processors that feature 32-nanometer process technology providing higher performance at lower power than previous processors.

DFI today launches the industrial grade EC200 series systemwith passive cooling and anti-shock drive bay mounting designedfor factory floor environments. The unique modular-concept construction supports 12 system confi gurations using three riser cards and three I/O module options in a cable-free assembly. Virtually unlimited systems confi gurations are possible using low-cost OEM I/O modules designed to meet custom OEM specifi cation requirement...

DFI, a leading provider of embedded x86 products, today launches the EL620-C ATX form factor motherboard utilizing a low-cost Intel® G41 Express chipset with Intel® I/O Controller Hub 7. This new embedded board supports the 45nm Intel® Core™2 Quad processor Q9400 with up to 6MB of shared L2 cache and up to 1333MHz Front Side Bus (FSB), delivering high-performance computing in multi-threaded and multitasking environments. Embedded Intel® Arc...

DFI today launches the Mini-ITX form factor SB100-NRM scalable desktop platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® Q67 chipset supporting the quad core Intel® Core™ i7-2600 and i5-2400 processors, and dual core Intel® Core™ i3-2120 processor utilizing 32-nanometer process technology.

DFI today launches the COM Express basic type 2 form factor HR900-B mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded module uses an Intel® QM67 Express chipset supporting the quad core 2nd Generation Intel® Core™ i7-2710QE processor and dual core 2nd Generation Intel® Core™ i5-2510E processor on 32nm process technology.

DFI today launches the Mini-ITX form factor HR100-CRM mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® QM67 Express chipset supporting the quad core 2nd Generation Intel® Core i7-2710QE processor and dual core 2nd Generation Intel® Core™ i5-2510E processor on 32nm process technology.

DFI launched the Mini-ITX form factor SB330-CRM scalable desktop platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® Q67 chipset supporting the quad core Intel® Core™ i7-2600 and i5-2400 processors, and dual core Intel® Core™ i3-2120 processor utilizing 32-nanometer process technology. The graphics and processor...

DFI today launches a new Qseven form factor computer-on-module product, QB700-B, offering low power consumption, integrated memory, improved graphic processing support and I/O interface flexibility. This cutting-edge module pairs the Intel Platform Controller Hub EG20T with a low power processor form the Intel Atom processor E6xx series. This Intel Atom processor series is built on 45-nanometer process technology with integrated memory controller...