The launch of a European Commission Horizon 2020 project has been announced by Leti which is to enable mass commercialisation of Si-photonics-based transceivers to meet future data transmission requirements in data centres and super computing systems. 

  Leti, an institute of CEA Tech, and three French partners are collaborating in a “house-cleaning” project aboard the International Space Station that will investigate antibacterial properties of new materials in a zero-gravity environment to see if they can improve and simplify cleaning inside spacecraft.

A technology that lowers readout noise for image sensors down to 0.5 electron noise and improves low-light image sensing capabilities has bean announced by Leti and PYXALIS. The technology, called Owly-eyed, is based on a patented electrical architecture of the pixel readout that can be integrated in image sensors. 

Leti, an institute of CEA Tech, and the Institute for Information Industry of Taiwan (III), a non-profit non-governmental technology development organisation, announced an agreement for mutual exploration of a wide range of information and communications technology (ICT) related to the IoT and 5G wireless connectivity. The five-year collaboration will include, but is not limited to, joint development and implementation of IoT and 5G based Sm...

  Leti, an institute of CEA Tech, and OT (Oberthur Technologies) announced they have signed a letter of intent to collaborate on a wide range of technologies and digital solutions for security and performance in a connected world. These areas include biometrics, component and systems security, electronics, low-power architecture, IoT and connectivity.

  Developing technology and architectures, international project for mimicking neural behavior in integrated circuits will review creating neuromorphic circuits and bring together the device and design communities for the promising field 12th September in Lausanne, Switzerland.

Following validation of its innovative smart-city tools that combine IoT and cloud-computing technologies, the EU-Japan ClouT consortium will expand its goals and add cities and partners in the new BigClouT programme. The expanded programme will focus on distributed intelligence with edge-computing principles, big-data analytics capability and self-aware property.

An institute of CEA Tech, Leti, and the Korea Institute of Science and Technology (KIST) have announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.

Leti has announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.

An institute of CEA Tech said today its teams have demonstrated how Fully Depleted Silicon on Insulator (FDSOI) technology can be scaled downwards.

Leti, an institute of CEA Tech, is hosting a one-day conference covering “System Reliability & Security in a Connected World” in Lyon, France, on June 23. Held at the Lyon Congress Center, this Leti Innovation Day event will explore novel, effective ways to ensure security in the emerging new phase of the digital revolution launched by the IoT.

The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a R&D agreement signed in Paris on Thursday 12th May. This collaboration, extended to several key areas in digital technology, will enable the two sides to develop a shared R&D programme and jointly submit research and innovation projects on a European scale, particularly as regards High Performance Computing (HPC), as part of the Horizon 2020 programme.

A team from Leti and the University of Grenoble-Alps, along with Leti’s international partners, have developed a technique to diagnose performance problems of nanoresonators, nanosensors used in industry, research and medical diagnosis.

CEA-Leti will make two presentations during the EU-Japan Symposium on 5G, ‘From Challenges to Standardisation’, in Tokyo, 8-10th of February.The purpose of the gathering of European and Japanese stakeholders such as the European Commission, industry manufacturers, telecommunication operators, service providers, regulators, research organisations and government ministries is to discuss Japanese and EU perspectives for development of 5G...

Leti will host a workshop from on the 16th of February, during SPIE Photonics West, focusing on some of its recent developments in photonics applications. Leti researchers also will present four invited papers, 14 overall, during the Feb. 13th-18th conference in San Francisco’s Moscone Center.

CEA-Leti will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely high-speed wireless data transmission between mobile devices and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.

Two years after the launch of the PICS project (funded by the FP7 funding instrument dedicated to research for the benefit of SMEs), three European SMEs, IPDiA, Picosun and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved during this programme.

Patrick Boisseau, Chairman, European Technology Platform on Nanomedicine (ETPN), said that nanomedicine in Europe is rapidly progressing from a primarily academic-research-oriented and fragmented field to a multi-national programme sharply focused on bringing the benefits of nanomedicine to all Europeans.

CEA-Leti has announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES’ 22FDX technology platform. Launched this summer, GLOBALFOUNDRIES’ 22FDX technology platform is the industry’s first 22nm FD-SOI semiconductor technology developed specifically to meet the ultra-low-power requirements of the next gen of connected devices. The versatility of the 22FDX platform is a ...

In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.