Cadence Design Systems
- Bagshot Road
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RG12 OPH
United Kingdom - +44.1344.360333
- http://www.cadence.com
- + 44.1344.869647
Cadence Design Systems Articles
Cadence Completes Acquisition of Evatronix IP Business
Cadence Design Systems today announced that it has completed the acquisition of the IP business of Poland-based Evatronix. The acquisition further strenthens Cadence Design Systems' IP cores portfolio.
PMC Adopts Cadence Physical Verification System as Signoff Technology for Large Complex SoC
Cadence Design Systems announced today that PMC has adopted the Cadence Physical Verification System as signoff technology for its global design centers. PMC has used the Physical Verification System for several successful tapeouts, including PMC’s DIGI 120, described as the industry’s only single-chip processor supporting 10G, 40G and 100G speeds for OTN transport, aggregation and switching.
Cadence Design Tools Certified for TSMC 16nm FinFET Process and for TSMC 20nm Process
Cadence Design Systems announced today that several of its system-on-chip development tools have achieved version 0.1 of design rule manual and SPICE model tool certification for TSMC’s 16-nanometer FinFET process.
TSMC Certifies Cadence Tempus Timing Signoff Solution for 20nm Designs
Cadence Design Systems announced today that TSMC has certified the new Cadence Tempus Timing Signoff Solution at 20 nanometers. The certification means the Cadence Tempus Timing Signoff Solution passes TSMC’s rigorous EDA tool certification to enable customers to achieve accuracy required for advanced technologies.
Cadence Announces The Tempus Timing Signoff Solution
In a move to ease and speed the development of complex ICs, Cadence Design Systems introduce the Tempus Timing Signoff Solution, a new static timing analysis and closure tool designed to enable System-on-Chip developers to speed timing closure and move chip designs to fabrication quickly. The Tempus Timing Signoff Solution represents a new approach to timing signoff tools that enables customers to shrink timing signoff closure and analysis for fa...
Cadence Characterization Solution for Complex Multi-bit Cells Delivers Power and Performance Benefits for Yamaha
Cadence Design Systems today announced that it helped Yamaha Corporation reduce power consumption for its mobile consumer chips with characterization tools that delivered a 10 percent reduction in dynamic power to the clock network required for Yamaha ASICs.
Cadence to Acquire IP Business of Evatronix, Further Expanding IP Portfolio
Cadence Design Systems today announced its intent to acquire the IP business of Evatronix SA SKA, adding to its rapidly expanding IP offering. Based in Poland, Evatronix delivers a silicon-proven IP portfolio, which includes certified USB 2.0/3.0, Display, MIPI, and storage controllers, which are highly complementary to Cadence’s IP offering.
Cadence Incisive Enterprise Simulator Improves Low-Power Verification Productivity By 30%
Cadence Design Systems today introduced a new version of Incisive Enterprise Simulator, with features that improve low-power verification productivity of complex SoCs by thirty percent. The 13.1 release of Cadence Incisive Enterprise Simulator addresses low-power verification challenges for advanced modeling, debug, power format support and to provide faster verification for today’s most complex SoCs.
Cadence and GLOBALFOUNDRIES Collaborate to Improve DFM Signoff for 20- and 14-Nanometer Nodes
Cadence Design Systems announced that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers. GLOBALFOUNDRIES is using the Cadence Pattern Classification and Pattern Matching Solutions because they enable up to four times faster design for manufacturing, which is key to improving customers’ silicon yield and predictability.
Cadence Reports First Quarter 2013 Financial Results and Completes Acquisition of Tensilica
Cadence Design Systems today announced results for the first quarter of fiscal year 2013. Cadence reported first quarter 2013 revenue of $354 million, compared to revenue of $316 million reported for the same period in 2012.
Cadence And TSMC Strengthen Collaboration On Design Infrastructure For 16nm FinFET Process Technology
Cadence Design Systems announce an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications. The deep collaboration, beginning earlier in the design process than usual, will effectively address the design challenges specific to FinFETs – from design analysis through signoff – and will deliver the infrast...
ARM and Cadence Partner to Implement Industry’s First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process
Fulfilling the promise of performance and power scaling at 16 nanometers, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC’s 16-nanometer FinFET manufacturing process.
Cadence to Acquire Tensilica
Cadence Design Systems today announced that it has entered into a definitive agreement to acquire Tensilica for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.
Cadence Announces First Commercially Available Design IP and Verification IP for Mobile PCI Express
Cadence Design Systems today introduced the first commercially available design IP (IP) and verification IP (VIP) supporting the new Mobile PCI Express (M-PCIe) specification, which enables today’s leading innovators to develop products with both PC-class performance and extended battery life.
Cadence Rolls Out 2013 CDNLive User Conferences
Cadence Design Systems kicks off its worldwide series of user conferences, starting with CDNLive Silicon Valley, March 12 and 13 in Santa Clara. CDNLive conferences provide an excellent opportunity for Cadence customers to collaborate and dig deeper into the latest technologies and methodologies with Cadence experts.
Cadence to Showcase Latest Verification Tools and Methodologies at DVCon 2013
Cadence Design Systems today announced its participation at DVCon 2013, the seminal conference for functional design and verification that takes place at the DoubleTree Hotel in San Jose, California on the 25-28 February 2013,
Cadence Elects Young K. Sohn to Board of Directors
Cadence Design Systems today revealed the election of Young K. Sohn, president and chief strategy officer of Samsung Electronics to its board of directors. Mr. Sohn brings substantial industry, financial, operational and governance expertise to Cadence through his experience in executive leadership at leading semiconductor firms and advisory roles in investment firms. The company also announced the retirement of Donald L. Lucas from the board.
Cadence Expands IP Portfolio with Agreement to Acquire Cosmic Circuits
Cadence Design Systems today announced an agreement to acquire Cosmic Circuits Private Limited. Cosmic Circuits offers silicon-proven IP solutions in connectivity and advanced mixed-signal technologies in the 40nm and 28nm process nodes, with 20nm and FinFET development well underway.
GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes
Cadence Design Systems announced today that two of its major foundry partners—Samsung Foundry and GLOBALFOUNDRIES—are supporting new Cadence custom/analog technology targeting designs at the advanced nodes of 20 and 14 nanometers. The two foundries are providing SKILL-based process design kits for the newly introduced Cadence Virtuoso Advanced Node.
Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process
Cadence Design Systems announced today that GLOBALFOUNDRIES has certified essential Cadence technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology. The certification covers the Virtuoso and Encounter platforms, including the industry-standard SKILL process design kit (PDK).