Bostik is set to celebrate four decades of continuous innovation of its bio-based Thermelt product range at the upcoming Productronica Trade Show.

As a result of their collaboration, Bostik and Polytec PT are launching a new range of thermal conductive adhesives (TCA).

As a result of their collaboration, Bostik and Polytec PT are launching a new range of thermal conductive adhesives (TCA) to address the challenge of thermal management in the latest Cell-to-Pack (CTP) battery design for e-mobility solutions.

Bostik has extended its Born2Bond engineering adhesive HMPUR and UV-CIPG ranges to support the manufacture of smaller, more lightweight, and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations.

Bostik’s Born2Bond HMPUR and UV-CIPG engineering adhesive ranges have been extended to serve the needs of automotive electronics designers and manufacturers looking to protect automotive components from heat, liquids, humidity, chemicals and vibrations.

The R&D team at Bostik’s Born2Bond engineering adhesives brand has revealed details of a new precision dispensing system at the in-adhesives symposium, which enables the easier use of cyanoacrylate adhesives in high-precision robotic manufacturing to bond automotive and electronics product parts with complex shapes and geometries.

Bostik’s Born2Bond™ R&D team has released details of a new cyanoacrylate-based adhesive prototype at the in-adhesives event, proving how products are being developed for a near-future that will see instant adhesives used for long-term critical applications such as those required in the automotive and electronics industry.

The range of engineering adhesives includes new, low-odor formulations, which enable a more comfortable manufacturing environment, and low-blooming solutions. Blooming is the effect of adhesive being squeezed out between parts being assembled and causing staining.