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ANSYS

  • Southpointe 275 Technology Drive Canonsburg
    PA 15317
    United States of America
  • 1.724.746.3304
  • www.ansys.com
  • 1.724.514.9494

ANSYS Articles

Displaying 1 - 20 of 31
Wireless
25th June 2020
UK public failing to recognise the potential of 5G

A new global study from physics-based simulation company Ansys has uncovered the British public is lagging behind other countries in attitudes to 5G. Only 22% of Brits believe the excitement over 5G is warranted and will be a drastic improvement over 4G.

Design
18th May 2018
What do Red Bull Racing and Dyson have in common?

The 2018 Ansys Innovation Conference saw a day full of innovative technologies and solutions with a vast number of companies including, Dyson, Wirth, Rolls Royce and Hydratight just to name but a few. To start the day off with a bang the audience heard from Kristan Bromley of Bromley Technologies, a retired British skeleton racer, who won a gold medal at the men’s event in the 2008 FIBT World Championships in Germany, (Britain’s ...

Design
19th May 2016
Big data machine learning system for engineering simulation

The newly launched ANSYS SeaScape architecture enables organisations to innovate faster than the ever by delivering accelerated design optimisation of next-generation chips. The architecture is a marriage of the advanced computer science of elastic computing, big data and machine learning, to the physics-based world of engineering simulation.

Analysis
5th May 2016
Agreement reached to reduce development cycle times

An agreement between ANSYS and Future General Electric will assist the company in reducing risk and unplanned down-time. The new agreement expands GE’s use of ANSYS engineering simulation solutions to accommodate its November 2015 acquisition of Alstom’s Power and Grid businesses.

Design
17th March 2016
Opening the door for cutting-edge electronic products

Manufacturers of advanced electronic products - ranging from mobile and networking appliances to futuristic Internet of Things devices – will benefit from TSMC’s certification of ANSYS solutions for its 10nm FinFET process technology.

Design
27th January 2016
ANSYS unveils release 17.0

Engineers across disciplines – from structures to fluids to electromagnetics to systems – will realise step-change improvements in the way they develop products using the newly released ANSYS 17.0. This next gen of ANSYS  industry-leading engineering simulation solutions set the scene for the next quantum leaps in product development, enabling unprecedented advancements across an array of industry initiatives from smart devices t...

Analysis
17th December 2015
STEM programme electrifies student interest in earth & space

Students across the United States will soon be able to experience the thrill and adventure of space travel thanks to a new partnership between Space Training Adventure and Research (STAR) and ANSYS. This partnership will enable STAR to inspire and educate young minds about earth and space science by leveraging ANSYS simulation software.

Design
30th April 2015
Engineering simulation to help build quantum computers

The world’s 'most advanced' quantum computers are being built and designed by D-Wave Systems with help from engineering simulation solutions from ANSYS. This next-gen of supercomputers uses quantum mechanics to massively accelerate computation and has the potential to solve some of the most complex computing problems facing organisations today.

Communications
3rd February 2015
Sign-off solutions enable car infotainment system

By utilising power noise and reliability sign-off solutions from ANSYS, NXP Semiconductors has improved the overall performance of its car infotainment system. Due to the standardisation of digital radios in automobiles, scalable multi-standard support, improved reception performance and cost savings are driving NXP’s product development. Using ANSYS engineering simulation tools, NXP combined six chips into a single SoC, the SAF360x. 

Design
16th January 2015
Design tools enable 3D-ICs for use in next-gen CPUs

ANSYS has announced that Fujitsu is using its power noise and reliability solutions to create 3D ICs to meet performance requirements for next-gen high-performance CPUs. These chips leverage 3D-IC architecture to gain power, performance and price advantages, but the configuration increases design complexity and the challenges associated with power and thermal management.

Design
20th June 2014
ANSYS & TowerJazz Deliver Sign-Off Design Kit

ANSYS and TowerJazz has announced a collaboration to deliver comprehensive power noise and reliability sign-off flow for mutual customers. With increased use of analogue and radio frequency (RF) integrated circuits (ICs) in a variety of electronic systems including consumer, automotive, medical and industrial applications, the ability to accurately predict the performance of these ICs prior to production has become a critical design challenge.

Analysis
25th April 2013
ANSYS Appoints Walid Abu-Hadba as Chief Product Officer

ANSYS today announced that 20-year Microsoft veteran Walid Abu-Hadba has joined the Company as chief product officer, effective immediately, reporting directly to Jim Cashman, president and CEO. Abu-Hadba will be responsible for providing leadership for the overall strategy and management of the activities within our technical business units, including integration, development, research and patents.

Analysis
7th August 2012
Ansys and EADS sign Master Supply Agreement

EADS and ANSYS have today announced that they’ve signed a master agreement which further strengthens their 15 year relationship. The agreement means that Ansys will provide simulation tools to all divisions of EADS.

Power
20th June 2012
Ansys Making Electric Vehicle Batteries More Practical And Efficient

One year into a U.S. Department of Energy (DOE) funded project, ANSYS, General Motors LLC, the National Renewable Energy Laboratory (NREL) and ESim are leveraging engineering simulation technology to optimize electric and hybrid vehicle battery performance. The team achieved significant milestones during the past year in support of the DOE’s Computer Aided Engineering for Electric Drive Vehicle Batteries (CAEBAT) project.

Analysis
11th June 2012
Speedo uses ANSYS to develop Fastskin Racing System

Competitive swimmers this summer can streamline performance thanks to Speedo’s revolutionary Fastskin Racing System, which was designed using engineering simulation software from ANSYS. When worn together as a complete system, a Fastskin suit, cap and goggle can reduce full-body passive drag by up to 16.6 percent, improve oxygen economy by up to 11 percent (enabling the athlete to swim stronger for longer), and reduce active body drag by up to ...

Analysis
30th April 2012
ANSYS Announces Strategic Agreement With FMC Technologies

ANSYS and FMC Technologies have executed a long-term strategic agreement for simulation software that can standardize design analysis and provide scalability for growth.

Analysis
8th February 2012
Apache Design’s RTL Power Model Technology Honored with DesignCon 2012 Award

A technology from Apache Design, Inc. — an ANSYS subsidiary — has earned a prestigious award celebrating innovative electronics tools that simplify customer design processes. RTL Power Model (RPM) won DesignCon 2012’s DesignVision Award in the System Modeling and Simulation Tools category. Launched in late 2011, RPM technology enables organizations to optimize a wide range of power-sensitive applications, such as ultra-low-power electronics...

Analysis
26th January 2012
Exhibiting Advanced Chip Level Power Analysis, Optimization and Sign-off Solutions

Apache Design, Inc., a subsidiary of ANSYS today announced it will be sponsoring two complimentary Chip-Package-System (CPS) Workshops during DesignCon, at the Santa Clara Convention Center on February 1, in Santa Clara, California. These interactive sessions will bring together leading semiconductor companies and system houses to share their expert perspectives and best practices on chip and package modeling, and system-level verification for si...

Analysis
19th December 2011
ANSYS earns highest rating from Investor's Business Daily

ANSYS is one of only six technology businesses worldwide to receive the highest possible score in a new list of stock ratings published by Investor's Business Daily. The financial publication’s SmartSelect Composite Ratings of publicly traded companies grade stock performance on a scale of 1 to 99. ANSYS earned a rating of 99 earlier this month, the highest possible score. This places ANSYS among the top 1 percent of all stocks reviewed by the ...

Design
8th December 2011
Anysys 14.0 delivers capabilities for improved efficency, accuracy, speed and innovation in product development

ANSYS has launched the newest release of its engineering simulation technology suite, ANSYS 14.0. Designed to optimize product development processes, ANSYS solutions reduce the time and cost needed to foster product innovations.

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