Bianchi used Ansys simulation software to realise a 70% reduction in frame prototyping in the efficient optimisation of its road bike and e-bike designs – speeding time to market and reducing development costs.

Join Ansys at EUMW in Milan from 27th to 29th September at booth F22 and don’t miss the rich schedule of the Ansys Workshop Program dedicated to microwaves, RF and EMI/EMC (2nd Floor, room Amber 7).

A new global study from physics-based simulation company Ansys has uncovered the British public is lagging behind other countries in attitudes to 5G. Only 22% of Brits believe the excitement over 5G is warranted and will be a drastic improvement over 4G.

The 2018 Ansys Innovation Conference saw a day full of innovative technologies and solutions with a vast number of companies including, Dyson, Wirth, Rolls Royce and Hydratight just to name but a few. To start the day off with a bang the audience heard from Kristan Bromley of Bromley Technologies, a retired British skeleton racer, who won a gold medal at the men’s event in the 2008 FIBT World Championships in Germany, (Britain’s ...

The newly launched ANSYS SeaScape architecture enables organisations to innovate faster than the ever by delivering accelerated design optimisation of next-generation chips. The architecture is a marriage of the advanced computer science of elastic computing, big data and machine learning, to the physics-based world of engineering simulation.

An agreement between ANSYS and Future General Electric will assist the company in reducing risk and unplanned down-time. The new agreement expands GE’s use of ANSYS engineering simulation solutions to accommodate its November 2015 acquisition of Alstom’s Power and Grid businesses.

Manufacturers of advanced electronic products - ranging from mobile and networking appliances to futuristic Internet of Things devices – will benefit from TSMC’s certification of ANSYS solutions for its 10nm FinFET process technology.

Engineers across disciplines – from structures to fluids to electromagnetics to systems – will realise step-change improvements in the way they develop products using the newly released ANSYS 17.0. This next gen of ANSYS  industry-leading engineering simulation solutions set the scene for the next quantum leaps in product development, enabling unprecedented advancements across an array of industry initiatives from smart devices t...

Students across the United States will soon be able to experience the thrill and adventure of space travel thanks to a new partnership between Space Training Adventure and Research (STAR) and ANSYS. This partnership will enable STAR to inspire and educate young minds about earth and space science by leveraging ANSYS simulation software.

The world’s 'most advanced' quantum computers are being built and designed by D-Wave Systems with help from engineering simulation solutions from ANSYS. This next-gen of supercomputers uses quantum mechanics to massively accelerate computation and has the potential to solve some of the most complex computing problems facing organisations today.

By utilising power noise and reliability sign-off solutions from ANSYS, NXP Semiconductors has improved the overall performance of its car infotainment system. Due to the standardisation of digital radios in automobiles, scalable multi-standard support, improved reception performance and cost savings are driving NXP’s product development. Using ANSYS engineering simulation tools, NXP combined six chips into a single SoC, the SAF360x. 

ANSYS has announced that Fujitsu is using its power noise and reliability solutions to create 3D ICs to meet performance requirements for next-gen high-performance CPUs. These chips leverage 3D-IC architecture to gain power, performance and price advantages, but the configuration increases design complexity and the challenges associated with power and thermal management.

ANSYS and TowerJazz has announced a collaboration to deliver comprehensive power noise and reliability sign-off flow for mutual customers. With increased use of analogue and radio frequency (RF) integrated circuits (ICs) in a variety of electronic systems including consumer, automotive, medical and industrial applications, the ability to accurately predict the performance of these ICs prior to production has become a critical design challenge.

ANSYS today announced that 20-year Microsoft veteran Walid Abu-Hadba has joined the Company as chief product officer, effective immediately, reporting directly to Jim Cashman, president and CEO. Abu-Hadba will be responsible for providing leadership for the overall strategy and management of the activities within our technical business units, including integration, development, research and patents.

EADS and ANSYS have today announced that they’ve signed a master agreement which further strengthens their 15 year relationship. The agreement means that Ansys will provide simulation tools to all divisions of EADS.

One year into a U.S. Department of Energy (DOE) funded project, ANSYS, General Motors LLC, the National Renewable Energy Laboratory (NREL) and ESim are leveraging engineering simulation technology to optimize electric and hybrid vehicle battery performance. The team achieved significant milestones during the past year in support of the DOE’s Computer Aided Engineering for Electric Drive Vehicle Batteries (CAEBAT) project.

Competitive swimmers this summer can streamline performance thanks to Speedo’s revolutionary Fastskin Racing System, which was designed using engineering simulation software from ANSYS. When worn together as a complete system, a Fastskin suit, cap and goggle can reduce full-body passive drag by up to 16.6 percent, improve oxygen economy by up to 11 percent (enabling the athlete to swim stronger for longer), and reduce active body drag by up to ...

ANSYS and FMC Technologies have executed a long-term strategic agreement for simulation software that can standardize design analysis and provide scalability for growth.

A technology from Apache Design, Inc. — an ANSYS subsidiary — has earned a prestigious award celebrating innovative electronics tools that simplify customer design processes. RTL Power Model (RPM) won DesignCon 2012’s DesignVision Award in the System Modeling and Simulation Tools category. Launched in late 2011, RPM technology enables organizations to optimize a wide range of power-sensitive applications, such as ultra-low-power electronics...

Apache Design, Inc., a subsidiary of ANSYS today announced it will be sponsoring two complimentary Chip-Package-System (CPS) Workshops during DesignCon, at the Santa Clara Convention Center on February 1, in Santa Clara, California. These interactive sessions will bring together leading semiconductor companies and system houses to share their expert perspectives and best practices on chip and package modeling, and system-level verification for si...