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Alphawave Semi

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    ON M5J
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Alphawave Semi Articles

Displaying 1 - 11 of 11
Artificial Intelligence
26th November 2024
Alphawave Semi's chiplets picked by Rebellions

Alphawave Semi is happy to announce that South Korean AI chip firm Rebellions has selected Alphawave Semi's multiprotocol I/O Connectivity Chiplets for their next-generation project, REBEL.

Communications
1st November 2024
Alphawave awarded research grant

Alphawave Semi has been awarded a research grant from the UK's Advanced Research + invention Agency (ARIA) to address networking bottlenecks that are limiting AI's growth.

News & Analysis
30th September 2024
Silicon-proven 3nm, 24Gbps UCIe IP subsystem

Alphawave Semi has announced the availability of the industry's first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem.

Events News
20th September 2024
Alphawave will showcase AI and connectivity at ECOC

Alphawave Semi will showcase its latest innovations in AI and connectivity IP at the European Conference on Optical Communication (ECOC) in Frankfurt. 

Appointments
5th August 2024
Alphawave appoints Sameer Ladiwala

Alphawave Semi has announced the appointment of Sameer Ladiwala as SVP Finance & Chief Accounting Officer (CAO).  

Micros
30th July 2024
Alphawave Semi launches 3nm UCIe IP with TSMC CoWoS packaging

Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.

Memory
24th June 2024
Alphawave announces 9.2Gbps platform

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform. 

Memory
21st June 2024
Alphawave Semi unlocks 1.2TBps connectivity with 9.2Gbps HBM3E

Alphawave Semi, a global pioneer in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced a 9.2Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

Design
21st June 2024
IP sub-system takes chiplet memory bandwidth to 1.2 TBps

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

News & Analysis
17th June 2024
Alphawave Semi announces successful tape-out

Alphawave Sem has announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process. 

Design
11th June 2024
Alphawave, Samsung partnership extended to 2nm processes

Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.

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