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Adesto Technologies Corporation, Inc.

Adesto Technologies Corporation, Inc. Articles

Displaying 1 - 15 of 15
Memory
20th February 2020
Duo collaborate to deliver Flash-to-Cloud security

NanoLock Security has announced it is joining with Adesto Technologies to collaborate on flash-based embedded security and management solutions for low density flash memory devices used in products such as smart meters, sensors and controllers in smart energy, water utilities, industrial facilities and more.

Boards/Backplanes
18th February 2020
Click board provides fast and easy prototyping

Adesto Technologies and MikroElektronika (Mikroe) have announced the availability of a new Click board that uses Adesto’s FT 6050 Smart Transceiver SoC. The plug-and-play FT Click provides a universally accepted interface via a mikroBUS socket to nearly any embedded IoT ecosystem so that engineers, developers, and makers can readily prototype thousands of different IoT applications.

Memory
22nd January 2020
Smart meter begins pilot program in Africa and Middle East

Adesto Technologies has announced that its Non-Volatile Memory (NVM) and Power Line Communications chips are designed into a new G3-PLC smart meter that is now in pilot production targeting utility providers in Tunisia, Egypt, and other countries.

Analysis
6th January 2020
Partner program to accelerate time-to-market for customers

Adesto Technologies has announced it has joined the STMicroelectronics Partner Program to enable optimal system operation for emerging IoT devices through the combination of its non-volatile memory (NVM) devices and the STM32 line of microcontrollers (MCUs). 

Communications
10th October 2019
Developing next-generation satellite communications technology

Adesto Technologies has announced it is engaging with the European Space Agency (ESA) through the agency’s ARTES Competitiveness and Growth (C&G) programme to develop technologies for next-generation mobile satellite communications.

Memory
7th October 2019
Collaboration to expand xSPI ecosystem for emerging IoT devices

Adesto Technologies and Cadence Design Systems have announced they have collaborated to expand the ecosystem around the Expanded Serial Peripheral Interface (xSPI) communication protocol to enable higher transfer rates and lower latency for flash memory in internet of things (IoT) devices.

Design
14th August 2019
Smart transceiver natively supports LonWorks and BACnet protocols

Adesto Technologies has announced that the FT 6050 Smart Transceiver system-on-chip (SoC) now natively supports LON, LON/IP, BACnet/IP and BACnet MS/TP protocol stacks, enabling the popular LON and BACnet industrial protocols to communicate simultaneously over the highly reliable and widely adopted Free Topology (FT) channel.

Design
23rd July 2019
When reset is the only option, what do you do if there is no button?

It is widely believed that code can never be bug-free, and although embedded software developers will do everything they can to find and eliminate bugs, the best we can say is that the software has passed every test condition we could think of. Conversely, hardware is seen as being much more robust and, in general, can be relied on to work ‘properly’ all of the time. By: Paul Hill, Director, Product Marketing at Adesto Technologies.

IoT
26th April 2019
Building control systems to communicate security with IoT cloud

Adesto, IBM and NXP are demonstrating a powerful solution that provides a new level of security for smart building and IIoT deployments. Adesto's SmartServer IoT edge server and the IBM Watson IoT Platform, together enabled by NXP’s ready-to-use A71CH secure element for IoT devices, provide an extra layer of security for businesses connecting their systems securely to the IBM Cloud.

IoT
25th April 2019
Open edge server for building automation and industrial IoT

Provider of innovative embedded systems for the IoT era, Adesto Technologies, has announced general availability of its next-generation edge server for building automation and industrial IoT applications. SmartServer IoT is a truly open, full-featured and end-to-end industrial-rated IoT edge server. 

IoT
15th March 2019
Next-gen battery powered IoT products become a reality

Adesto Technologies has introduced new FusionHD Non-Volatile Memories (NVMs) designed for next-generation consumer and industrial IoT edge devices. FusionHD builds on the Smart IoT feature set of Adesto’s highly successful Fusion family with even more capabilities, patented low-power technology, security features, and increased memory density options.

Test & Measurement
14th January 2019
Predictive energy analytics for smart buildings

Adesto Technologies Corporation has announced that it is enabling smarter buildings through insights into energy management and other operational data through services running on the IBM Watson IoT platform.

Memory
17th August 2018
RAM technology targets high reliability automotive applications

Provider of innovative application-specific semiconductors for the IoT era, Adesto Technologies has announced it will present new research showing the significant potential for Resistive RAM (RRAM) technology in high reliability applications such as automotive. Adesto Fellow Dr. John Jameson, who led the research team, will share the results at the ESSCIRC-ESSDERC 48th European Solid-State Device Research Conference, being hel...

Memory
13th June 2013
Adesto Technologies Introduces DataFlash E-Series Serial Flash Memory

Adesto Technologies today announced the launch of the DataFlash “E”-series, a new family of non-volatile memory devices with lower power requirements and smart features for higher system efficiency and lower system costs. At introduction, the family includes 2 Mb, 4 Mb, 16 Mb and 32 Mbit memory devices, with 8 Mb and 64 Mb devices in development.

Analysis
13th June 2013
Adesto CBRAM Memory Technology Demonstrates Ultra Low-Power Operation

Adesto Technologies will demonstrate ultra-low power operation of its proprietary CBRAM memory in a paper to be presented at the 2013 Symposia on VLSI Technology and Circuits in Kyoto, Japan, June 11-14, 2013.

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