Electronica 2018: Dynamic, simultaneous support for Zigbee 3.0, Green Power, Thread and Bluetooth Low Energy is enabled in the system in package (SiP) announced by Qorvo.
The Qorvo QPG6095M SiP integrates the company’s power amplifier technology, providing 20dBm output and a multi-standard, multi-protocol chip. The power amplifier technology is particularly beneficial for US smart home applications.
The low power wireless communications SiP also extends range and battery life, and enables robust interference mitigation. It optimises connectivity within the home by eliminating the need for complex mesh architectures and unnecessary battery consumption in intermediate devices, explains the company. The multi-standard, multi-protocol chip
The level of integration is claimed to help product designers lower development costs and speed time to market.
The company’s wireless semiconductor systems for connected devices and Wi-Fi integrated front-end solutions, RF chips and software for smart home data communications and the IoT can be viewed at MRC-Gigacomp.
Visit Qorvo at the MRC Gigacorp stand.
Electronica 2018: Hall A6, stand 534