Seica SpA Develops Thermal SCAN For Aerial Flying Probers

Seica is the first flying prober OEM to introduce this feature on its line of flying probers. Introducing thermal sensors with the traditional features already present on flying probers, such as in-circuit, functional, boundary scan and power up test make the flying prober a continuing evolving test tool to satisfy the demanding test needs of the production and depot repair markets.

In the market today, there are instances of large 'bone piles' of boards that require many hours of debug and testing by skilled senior technicians or engineers to return them to operational condition. The IC Thermal Detection Unit capabilities allows for precise thermal measurement of the IC or other components while the part is powered up even under low voltage conditions. The simplicity of a thermal profile test can help reduce labor repair cost and improve inventory turnover.