Rugged panel PC features heat dissipation technology

Posted By : Jordan Mulcare
Rugged panel PC features heat dissipation technology

APLEX Technology has announced a series of expandable Panel PC to its industrial-grade computers portfolio. Utilising an Aluminum heat-sink, APLEX’s unique heat dissipation technology now supports wide-temperature range from -20-60°C in a fanless operating condition on the APC-3X19A series. The series is front IP65 certified, also featuring an accessible storage slot design that simplifies the installation and maintenance process.

Despite its rugged construction, APC-3X19A is lightweight and suitable for factory automation in almost any industrial applications. The series is available in both capacitive and resistive touch, sizes vary from 15, 17 to 19”.

The series is powered by 4th gen Intel processor with up to 16GB of memory to deliver superior computing and graphic processing performances. It also provides great flexibility in various fields with its rich I/O, expansion capability and configuration options (e.g. security automation application with PCIe capture card associating IP cameras). The system also offers two 2.5” SATA III with RAID function and an optional external CF slot.

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