Communications

DFI introduce new module based on the Intel HM86

9th August 2013
DFI
Nat Bowers
0

DFI have today announced the introduction of the HM960-HM86 Type 6 COM Express Basic module. Based on the Intel HM86 Express chipset, the new HM960-HM86 COM Express Basic module is offered in BGA 1364 packaging. Powered by the 4th generation Intel Core processor family built on 22-nanometer process technology, this module provides higher processing performance, superior graphics display support, and evolutionary improvements in system memory and I/O interfaces.

These enhancements in CPU performance, media and graphics capabilities, security and power efficiency make the HM960-HM86 suited for use in intelligent systems in a variety of market segments such as retail, medical, MAG, DSS and industrial manufacturing. Enabling faster communication between components, support is provided for up to 2 16GB of DDR3L 1333/1600MHz low voltage memory interfaces. The onboard memory storage, an optional SSD device, offers the persistent function of data storage.

The integrated 4th generation Intel HD Graphics 4600 engine provides smooth flash playback and rich 2D/3D graphics with high quality playback. It also supports Intel Clear Video Technology that supplies advanced imaging capabilities for Blu-Ray and other high definition video processing such as image stabilization, gamut mapping and frame rate conversion.

The enhancements in the instructions of Intel Advanced Vector Extensions 2.0 provide a significant performance improvement in integer and floating-point-intensive computations. These are a key part of digital signal and image processing applications such as medical imaging and weather radar. Targeted at both multimedia and medical applications, the HM960-HM86 brings additional features with Graphics APIs, including DirectX 11.1, OpenCL 1.2, and OpenGL 3.2 by supporting 3 display outputs in any combination of VGA, LVDS and DDI (HDMI, DVI, and Display Port). This allows designers to choose the best combination to suit the requirements of their application. VGA supported through the Intel HM86 Express chipset displays resolutions up to 2048x1536, and LVDS displays 24-bit, dual channel resolutions up to 1920x1200.

Incorporating high performance and flexible I/O capabilities, the Intel HM86 Express chipset provides increased mobile computing and graphics performance for the HM960-HM86 mobile platform. Supporting up to 2 SuperSpeed USB 3.0 interfaces, the integrated XHCI Host controller ports allow your system to process more data load and provide faster loading of frequently used applications.

It also supports 8 USB 2.0 interfaces, High Definition Audio interface, 2 Serial ATA 3.0 and 2 SATA 2.0 interfaces for applications that need fast storage speed. Other support includes 1 Intel Gigabit LAN controller to increase transmission speed for network-intensive applications, and 4-bit input and 4-bit output GPIO connector for device controls. The expansion design of this COM Express Basic module offers additional capabilities for the various demands via multiple PCIe configurations, including 1 PCIe x16 interface for high graphics displays and 7 PCIe x1 interfaces.

Thanks to the above features, the HM960-HM86 is a perfect mobile platform of embedded module for a whole range of applications requiring a stable revision-controlled platform, such as industrial control automation, digital signage, medical equipment, and KIOSK embedded applications.

HM960-HM86 key features:

  • COM Express Basic Module (95mm x 125mm)
  • Supports 4th generation Intel Core processors
  • Mobile Intel HM86 Express Chipset
  • Supports 2 DDR3L 1333/1600MHz SODIMM up to 16GB system memory
  • Supports 1 VGA, 1 LVDS and 3 DDI interfaces for 3 display outputs
  • 1 Intel Gigabit LAN interface
  • 2 USB 3.0 ports
  • 8 USB 2.0 ports
  • Supports 2 SATA 3.0, and 2 SATA 2.0
  • Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD (optional)
  • 4-bit input and 4-bit output GPIO connector
  • 1 PCIe x16 interface
  • 7 PCIe x1 interfaces
  • SATA to SSD onboard (optional)
  • Trusted Platform Module (optional)
  • Temperature Range - Operating: 0°C to 60°C, Storage: -20°C to 85°C

Humidity Range: 5% to 90%

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