Box PC supports up to three displays

18th September 2015
Source: MSI
Posted By : Siobhan O'Gorman
Box PC supports up to three displays

Designed for applications that require a high-performance or low-power computing kernel, the MS-9A69 embedded box PC has been introduced by MSI. The device supports two or three independent displays, versatile DC input of 12V/19V/24V, two Mini-PCIe expansion slots, and rich I/O of four LAN (w/ 2 optional), six USB, and six COM ports, offering the flexibility for machine builder and system integrators to build systems for automation, digital signage, IoT gateway, kiosk, POS, and bus or in-vehicle applications.

The box PC is designed with 3.5” embedded board to support high-performance Broadwell or silent BayTrail scheme; both are designed with efficient heat-spreading housing to support fanless applications with high reliability. The system is rated to operate under a wide range of -10 to -55oC, which fulfils most industrial scenes. Furthermore, the power input design of DC 12V/19V/24V caters to diverse application fields, such as factory automation, buses and cars.

Industrial applications always have a variety of devices, gateways, and hosts to connect and communicate with each other. That’s why MS-9A69 is designed with rich I/O, four LAN capability, and Mini-PCIe expansion slots. For display interfaces, it supports HDMI, VGA, and LVDS (for Broadwell scheme only). In order to allow more devices to be connected, it offers up to six COM ports and six USB ports. As to the communication aspect, the MS-9A69 has four LAN (two optional) for physical Ethernet networking, and the Mini-PCIe slots reserved for the WiFi or 3G communications.

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Building IoT products for smart healthcare market
8th February 2018
United Kingdom Cocoon Networks, London
Smart Mobility Executive Forum
12th February 2018
Germany Berlin
Medical Japan 2018
21st February 2018
Japan INTEX Osaka
Mobile World Congress 2018
26th February 2018
Spain Barcelona
embedded world 2018
27th February 2018
Germany Nuremberg