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Power Interconnect Solutions: Increasing Current Density And Reliability

22nd March 2010

ES Admin

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A new breed of power interconnects -- the MULTI-BEAM XLE and MINIPAK HDL connectors -- has been developed by Tyco Electronics to meet the growing demand for increased current density with modular power solutions. The new designs make better use of available airflow and offer improved long-term reliability. Contact design and material selection have been upgraded to address challenges related to energized mate and un-mate cycles and exposure to corrosion-enhancing environments while maintaining low milli-volt drops.

According to Mike Blanchfield, Tyco Electronics’ Product Manager and presenter of the power webinar, “While currently available standard solutions fall short of the high performance future needs of the industrial, computer and telecommunication markets, Tyco Electronics believes these new power interconnects will provide such solutions that will endure for years to come.”

On March 30 and 31, 2010, Tyco Electronics will present a webinar entitled “Power Interconnect Solutions: Increasing Current Density and Reliability”. The webinar will discuss high-performance power distribution interconnects and other topics related to heat dissipation and long-term reliability. Register at: http://www.tycoelectronics.com/industry/datacenter/power_webinar/webinar_power.asp?s_cid=2309

MULTI-BEAM XLE, MINIPAK HDL, and Tyco Electronics are trademarks of the Tyco Electronics group of companies and its licensors.