Cables/Connecting

MicroSD/micro-SIM combo connector saves space

25th November 2014
Siobhan O'Gorman
0

Claimed to provide mobile device manufacturers with a highly versatile connector that offers a lower profile and more compact size than competitive products, the microSD/micro-SIM combo connector has been released by Molex. Featuring a 2.28mm height with detect switch, the push-pull, normal-mount combo connector saves space by combining two card functions in one. This eliminates the need for an extra sub-PCB. 

The connector accepts cards that are stacked in the same direction, which provides easier access and a more optimum PCB layout. According to the company, the result is a combo connector with the lowest height and most compact size in the market.

Removing the need to turn off power or remove the battery, the microSD/micro-SIM combo connector enables the free insertion and withdrawal of the microSD card. The connector features an anti-stubbing contact terminal design, which prevents contact stubbing and ensures smooth insertion and withdrawal of cards. Card polarisation features, which prevent incorrect card insertion, are offered with the device. To prevent the microSD card from being stuck in case of incorrect insertion into the micro-SIM slot, the connector also features an anti-card sticking design.

With the introduction of the Molex microSD/micro-SIM, mobile device designers have a combo connector that offers an overall volume space savings of up to 15% compared to competitive products.

“Finding the best combination of space savings and easy access when designing-in microSD and micro-SIM cards has been a problem for mobile device designers,” said DongWook Kim, Global Product Manager, Molex. “Up until now, they had to either take up space for each card socket, or use a flex-to-board PCB to accommodate both form factors. The Molex microSD/micro-SIM combo connector solves this problem by providing substantial space savings while also providing easy card access. In addition, this design reduces manufacturing, assembly and component costs.”

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