Expansion of the ExaMAX backplane connector system

19th October 2016
Source: SAMTEC
Posted By : Enaie Azambuja
Expansion of the ExaMAX backplane connector system

Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, announces the expansion of the ExaMAX High-Speed Backplane Connector System optimised for high-density and high-speed performance. The scalable ExaMAX system meets today’s data rates while providing a future-proof path for next generation architectures.

The ExaMAX header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimised for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications.

Return loss compliance is achieved in both 85 Ω and 100 Ω systems due to targeting the 92 Ω specifications and controlling reflections at all geometry transitions within the connector.

Samtec’s highly-reliable ExaMAX system has the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stub is minimised for improved signal integrity performance.

A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment.

The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk.

The 2.00 mm-pitch, 40-differential-pair design (4 pairs x 10 columns) and the 72-differential-pair design (6 pairs x 12 columns) are now available. A 3.00 mm-column-pitch design for 56 Gbps performance is in development.

Optional add-on power modules support high current delivery with current ratings as high as 80 A per module. Hot-swapping support comes from various pin staging options for detecting shorts. Optional discrete guidance modules are available to assist with blind mating. Ruggedised construction enables support for maximum weight in a space saving design.

“Samtec’s expansion of our ExaMAX High-Speed Backplane Connector System provides engineers increased options as they consider current and future high-speed backplane architectures,” says Rick Skees, Samtec’s High-Speed Backplane Product Manager.

“These new additions to our ExaMAX portfolio will not be our last. We are currently developing new options for various orientations including coplanar, mid-plane orthogonal and direct-mate orthogonal (DMO.)”

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