FCI unveil 0.8mm connectors supporting 8 GT/s PCIe signalling

12th August 2013
Posted By : Nat Bowers
FCI unveil 0.8mm connectors supporting 8 GT/s PCIe signalling

FCI has today announced that the BERGSTAK 0.8mm mezzanine connectors have been successfully demonstrated to be capable of supporting PCI Express 3.0 signalling at 8 GT/s. With PCIe 3.0 signal performance demonstrated up to 10mm stack height, the compact, dual-row BERGSTAK 0.8mm pitch connector series is available in 40 to 200 positions in increments of 20 positions.

The wide spectrum of circuit sizes and stack heights allows the BERGSTAK 0.8mm connector family to support evolving designs and mechanical requirements in a variety of board-stacking applications.

“When evaluated with the recommended wiring pattern and PCB footprint BERGSTAK 0.8mm family met the PCI Express connector signal integrity requirements for differential insertion loss, return loss, near-end crosstalk and intra-pair skew to support signaling at the 8 GT/s data rate. The results demonstrate that the BERGSTAK 0.8mm connectors can effectively support the doubling in data throughput that PCI Express 3.0 provides over its predecessor,” commented Raymond Yuen, FCI portfolio director.

Maximising connection integrity, all of the BERGSTAK 0.8mm connectors feature a robust blade-on-beam contact design at the mating interface and surface-mount termination at the PCB interface. Providing easily repeatable mating that is precise and reliable, the new FCI connectors feature connector polarization at the mating interface and ample lead-in angles.

FCI’s versatile BERGSTAK 0.8mm connectors are ideal for mezzanine applications in computing, communications, industrial, medical and test equipment.

Key features and benefits:

  • 0.8mm double-row contact pitch conserves printed circuit board space,
  • Vast range of sizes and stack heights support diverse electronic packaging schemes,
  • 40 to 200 position sizes in 20 position increments,
  • 5mm to 16mm heights in 1mm increments,
  • PCIe Gen.3 high speed performance on all stack heights,
  • Choice of gold-based and palladium-based platings provide protection in different environments and applications,
  • Tapered PCB locator pegs increase the ease and accuracy of hand assembly,
  • Tape and Reel packaging supports high speed automated assembly,
  • Fully inter-matable with similar competitive connectors,
  • Optimized "blade-on-beam"; contact mating maximizes connection integrity,
  • Early receptacle contact point increases mating wipe and allows early engagement/late disengagement,
  • Precision-tapered receptacle contacts reduce mating force and preserve high final normal force,
  • Coined tips of plug contacts minimize contact wear and prevent stubbing.


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