The first is a 4U-wide, 500mm-deep case that features an 8-slot VME64x system backplane and an integrated 400W open-frame power supply. Offering a wide input-voltage range and power factor correction, the integrated PSU allows all eight slots of the backplane to be utilised for board assemblies.
The second case is a 5U-wide, 300mm-deep version equipped with a front-pluggable 19in. power supply and a 7-slot VME64x system backplane.
Providing enough space to accommodate a variety of different drives, both tower cases incorporate fan cooling that directs air from the bottom to the top through the system. A microcontroller-based fan control module (FCM) regulates the fan speed according to the temperature within the system and
also filters interference from the fan in accordance with the levels set in the VME standard.
Using proven technology, the new VME64x tower systems are based on the
internal assembly of Schroff's europacPRO subrack and the external
appearance of the ratiopacPRO system case.
In addition to its wide range of subracks, cases and cabinets, Schroff also
offers a comprehensive system integration service that enables customers to
reduce overheads and product development times by outsourcing some or all of
their design and manufacturing activities.