Advanced Thermal Solutions, Inc. (ATS) has partnered with Digi-Key, the global electronic components distributor, to offer over 380 heat sinks for cooling BGAs and other hot-running semiconductor devices. The heat sinks are available for immediate delivery when purchased through Digi-Key’s Web site and printed catalogs. Design engineers can obtain individual ATS sinks for prototypes and testing, or larger volumes for production requirements. Digi-Key’s online tools allow customers to check real-time inventory and order parts 24 hours per day, every day of the year.
“Now engineers can quickly access the largest range of BGA cooling solutions on the market,” said Dr. Kaveh Azar, president and CEO of ATS. “Each hot component problem presents unique challenges. Digi-Key makes it easy to find a heat sink that not only provides effective cooling, but also fits in the available space, attaches properly, and most importantly is within the allowed budget.”
According to Andrew McWilliams an analyst at BCC Research, the world market for thermal management products will grow from about $4.4 billion in 2006 to $5.9 billion by 2008 and approach $6.7 billion by 2011.
Among the ATS cooling solutions offered through the Digi-Key catalogue are maxiFLOW™ flared fin, high-performance heat sinks, along with straight-fin and cross-cut extruded sinks. Other heat sinks are available for cooling Freescale MPC 8641D dual-core and LGA processors, a wide variety of ASICs, and for linear LED lighting applications. Every heat sink is provided with performance and physical specification.
Digi-Key customers can also order the ATS maxiGRIP system for safe and secure heat sink attachment to flip chips, BGAs, and other hot on the PCB components. The maxiGRIP system features a plastic frame clip that snaps securely around a component’s perimeter. A stainless steel spring clip runs though the heat sink’s fin field and fastens securely to the plastic frame. As a result, the sink is mounted securely to the component with steady, even pressure. ATS’ maxiGRIP assemblies are available in a wide-range of component sizes from 17 mm x 17 mm to 45 mm x 45 mm.