Enclosures

Displaying 1381 - 1385 of 1385

"Form-in- Place" EMI Shielding Gasket

"Form-in- Place" EMI Shielding Gasket
Laird Technologies has introduced high strength "Form-In-Place" gaskets that are ideally suited for a broad range of applications where shielding, environmental protection and durability are key requirements.
2nd March 2006

Thermal interface material for automotive applications

Thermal interface material for automotive applications
Laird Technologies Thermal Products has introduced a cost-effective insulator designed specifically for automotive applications.
2nd March 2006

Thermally conductive, low-cost, film-based electronic insulator

Thermally conductive, low-cost, film-based electronic insulator
Laird Technologies Thermal Product business unit (formerly known as Thermagon) has introduced its T-gard™ 5000—a thermally conductive, low-cost, film-based electronic insulator for switching-mode power supply (SMPS) devices used in telecommunication and computer networking products.
2nd March 2006


Enclosure and door sealing made easy with Kemtron

Enclosure and door sealing made easy with Kemtron
Extruded gasket profiles in soft easy to compress silicone sponge suitable for enclosure and door sealing. The material is approved to UL94V0 for flame retardency making it suitable for indoor applications.
13th December 2005

RoHS compliant EMC ventilation panels

RoHS compliant EMC ventilation panels
Kemtron has introduced a RoHS compliant aluminium passivation process for its aluminium honeycomb EMC ventilation panels. The process has eliminated the hexavalent chromium which is present in some aluminium passivation processes. The new conversion coating meets the requirements of Mil-C-5541E for corrosion and electrical conductivity.
13th December 2005


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