Supplier of standardised and customised embedded computer boards and modules, congatec, has entered the 3.5” single board computer (SBC) business with a 40% performance boost for existing applications. To achieve this performance increase, the new conga-JC370 3.5” SBCs are equipped with commercial-grade 8th Generation Intel Core i7 Mobile processors, codenamed Whiskey Lake.
congatec offers this new processor generation in an embedded form factor, allowing the company to play a pioneering role in the rollout for the harsh environment. OEM customers benefit from the very early stage access to new high-end BGA processor technology with the opportunity to realise first-to-market advantages. In the future, congatec will support all major processors suitable for this compact SBC form factor, including various embedded variants of the brand new 8th Generation Intel Core i7 Mobile processors.
“With this launch, 3.5” board users benefit from a new player in the market differentiating itself through added value that other providers cannot or will not afford,” explained Jürgen Jungbauer, Product Line Manager for SBCs at congatec. “For example, customers profit from lower design-in costs thanks to comprehensive consulting, personal integration support and extensive BSPs. The high design quality of the boards also results in lower maintenance and service costs, less replacement during operation, less system downtime, lower design change costs, lower power consumption and longer board life.”
With the entrance in the 3.5” SBC business, congatec is driving the constant expansion of its product portfolio on the board level. Customers benefit in several ways from this broader board level and solution platform offering: There is a wider product range to choose from, and the development of application-ready computing cores for boards and modules is spreading to more and more products, which reduces costs through reuse and lowers prices.
Ultimately, even developers using different form factors can take advantage of this access to identical components, BSPs and documentation, which also reduces costs for the OEM.