ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principal for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.
ADLINK’s COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel Core i7, i5 or i3 processors and accompanying Intel QM170 and HM170 Chipset. In addition, the Express-SLE COM Express Basic Size module features the Intel Xeon processor E3-15XX v5 family and Intel CM236 chipset and supports ECC memory.
In all models, DDR4 memory is supported up to a total of 32GB at 1867/2133MHz, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. The COMs can support up to 32GB DRAM in two sockets, removing the 16GB limitation DDR3 posed. In addition the boards benefit of the enhanced security capabilities of the chipset including new AES instructions, faster encryption as well as the Intel Software Guard Extension and Memory Protection.
These COMs support three independent UHD/4K displays and hardware codec H.265/HVEC with Intel Gen9 graphics, making them well-suited for image-intensive applications in automation, medical, and infotainment. Models with an extended operating temperature range of -40 to +85°C are also available for transportation and defense applications.
ADLINK’s latest 6th gen Intel Core processer-based COMs also provide flexible system integration with configurable TDP (cTDP), which allows developers to modify processor behavior to the extent that power consumption and TDP (thermal design power) can be configured, the CPU power consumption can be as low as 7.5W allowing for even higher CPU performance when constrained in power usage (running on batteries) or heat dissipation (thermal conditions). The rich I/O includes up to three DDI channels, one LVDS (or 4 lanes eDP), eight high-speed PCIe Gen3, four SATA 6 Gb/s, GbE, four USB 3.0 and four USB 2.0.
“This latest CPU tock not only brings lower power envelopes but also doubles memory capacity, which is an important feature for space-constrained systems with increased density and reduced power consumption,” said Dirk Finstel, executive vice president of ADLINK’s Module Computing Product Segment. “In addition, support for Ultra-HD/4K and strong GPGPU performance underline the new capabilities that are necessary in today’s embedded applications.”
All new modules are equipped with ADLINK’s Smart Embedded Management Agent (SEMA) to provide access to detailed system activities at the device level, including temperature, voltage, power consumption and other key information, and allow operators to identify inefficiencies and malfunctions in real-time, thus preventing failures and minimising downtime. ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are accessible any place, at any time via encrypted data connection