Cloud-enabled kit leads to secure IoT applications

26th January 2016
Posted By : Mick Elliott
Cloud-enabled kit leads to secure IoT applications

The LPC43S67 & A70CM Cloud Connectivity Kit which will help design engineer to successfully build secure IoT applications with AES encryption, NFC, WiFi, and a host of sensing technologies, driven by powerful, multi-core ARM processing capabilities is available at Farnell element14.


Beyond the target hardware, which includes the LPCXpresso43S67 board with LPC43S67 dual-core (M4F and M0+) MCU and NXP A7001CM Secure Element, NTAG NDC plug-in card, LPC General Purpose Shield (hosting an accelerometer, gyroscope, temperature sensor, joystick and LCD), IEEE 802.11b/g SD card, this kit is supported by NXP’s LPCXpresso IDE and ZentriOS – a complete connected product operating system available as a licensable software solution.  

The Zentri SDK, can be easily combined with the rich editing and debugging capabilities of the LPCXpresso IDE by installation of a free plugin.

Debugging is simplified by LPCXpresso43S67’s on-board Link2 probe, which provides full source code debugging capability without the need for any additional hardware.

element14 is also launching the NXP LPCXpresso43S67 and LPCXpresso4367 Development Boards individually enabling development and prototyping on the LPC43xx and LPC43Sxx series MCUs from NXP.

These boards offer a high-performance, dual-core ARM Cortex processor Cortex-M4F and Cortex-M0+ running at up to 204MHz, along with IC-enabled security for development and prototyping of secure mobile or cloud-connected applications LPC43Sxx devices only.

The board is expandable by way of Arduino Uno R3 and Pmod-compatible headers. Debug is enabled via on-board, high-speed USB debug probe.

The LPCXpresso family of boards provides a powerful and flexible development system for NXP's Cortex-M MCUs.

The boards have been developed by NXP to enable evaluation of and prototyping with the LPC4300 series of MCUs, and features the LPC43S67 and LPC43S67 in their 100 PIN BGA package option.

With LPCOpen Software Packages, users can quickly and easily utilise NXP's extensive array of microcontroller software libraries to create and develop multifunctional products.


You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

EMO Hannover 2019
16th September 2019
Germany Hannover
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
HETT 2019
1st October 2019
United Kingdom EXCEL, London
World Summit AI 2019
9th October 2019
Netherlands Taets Park, Amsterdam
New Scientist Live 2019
10th October 2019
United Kingdom ExCeL, London